LT1767EMS8-5#TRPBF Linear Technology, LT1767EMS8-5#TRPBF Datasheet - Page 12

• Manufacturer Part Number: LT1767EMS8-5#TRPBF
• Description: IC SW REG STEP-DOWN 5V 8-MSOP
• Manufacturer: Linear Technology
• Type: Step-Down (Buck)r

Specifications of LT1767EMS8-5#TRPBF

• Internal Switch(s): Yes
• Synchronous Rectifier: No
• Number Of Outputs: 1
• Voltage - Output: 5V
• Current - Output: 1.5A
• Frequency - Switching: 1.25MHz
• Voltage - Input: 3 ~ 25 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -

LT1767/LT1767-1.8/
LT1767-2.5/LT1767-3.3/LT1767-5
APPLICATIONS
Total power dissipation is 0.34 + 0.05 + 0.01 = 0.4W.
Thermal resistance for LT1767 package is influenced by
the presence of internal or backside planes. With a full
plane under the package, thermal resistance for the
exposed pad package will be about 40 C/W. No plane will
increase resistance to about 150 C/W. To calculate die
temperature, use the appropriate thermal resistance
number and add in worst-case ambient temperature:
12
T
J
= T
A
+
JA
(P
TOT
MINIMIZE LT1767,
U
)
C3, D1 LOOP
INFORMATION
U
Figure 6. Typical Application and Suggested Layout (Topside Only Shown)
12V
V
CERAMIC
IN
2.2 F
W
L1
C3
C2
OPEN
HIGH
= ON
OR
CMDSH-3
U
V
D2
D2
IN
V
SHDN
SYNC
IN
V
OUT
LT1767-2.5
BOOST
GND
C1
C3
V
C
V
R
4.7k
GND
SW
D1
FB
KELVIN SENSE
V
When estimating ambient, remember the nearby catch
diode and inductor will also be dissipating power.
C
C
1.5nF
OUT
C
0.1 F
V
P
P
C2
DIODE
DIODE
F
= Forward voltage of diode (assume 0.5V at 1A)
D1
UPS120
CONNECT TO
GROUND PLANE
5 H
L1
V V
0 5 12 5 1
F
.
GND
1767 F06a
C1
10 F
CERAMIC
IN
12
OUTPUT
2.5V
1.2A
SHDN
SYNC
1767 F06
PLACE FEEDTHROUGHS
AROUND GROUND PIN
AND UNDER GROUND PAD
FOR GOOD THERMAL
CONDUCTIVITY
R
C
C
C
V
V
IN
OUT
KEEP FB AND V
COMPONENTS
AWAY FROM
HIGH INPUT
COMPONENTS
I
LOAD
0 29
.
W
C
sn1767 1767fas