NCP1589BMNTWG ON Semiconductor, NCP1589BMNTWG Datasheet - Page 10

• Manufacturer Part Number: NCP1589BMNTWG
• Description: IC CTLR SYNC BUCK 1PH LV 10-DFN
• Manufacturer: ON Semiconductor
• Type: Step-Down (Buck)r

Specifications of NCP1589BMNTWG

• Internal Switch(s): No
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: Adj to 0.8V
• Current - Output: 1.5A
• Frequency - Switching: 600kHz
• Voltage - Input: 4.5 ~ 13.2 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 10-VFDFN Exposed Pad
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -

10X
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2X
2X
REFERENCE
0.10 C
0.05 C
10X
10X
0.10 C
0.08 C
0.15 C
K
PIN 1
L
0.15 C
A B
NOTE 3
10X
Ç Ç Ç
Ç Ç Ç
Ç Ç Ç
Ç Ç Ç
DETAIL B
b
10
BOTTOM VIEW
1
SIDE VIEW
TOP VIEW
e
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
D2
D
5
6
(A3)
A1
DETAIL A
A
B
E
E2
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
A
0.5651
C
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
10X
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
SEATING
PLANE
2.1746
MOLD CMPD
0.3008
L1
http://onsemi.com
DFN10, 3x3, 0.5P
CASE 485C−01
10X
A1
SOLDERING FOOTPRINT*
Bottom View
ISSUE B
(Optional)
DETAIL A
10
É É É
É É É
É É É
Side View
(Optional)
DETAIL B
EDGE OF PACKAGE
2.6016
EXPOSED Cu
DIMENSIONS: MILLIMETERS
0.5000 PITCH
1.8508
A3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. TERMINAL b MAY HAVE MOLD COMPOUND
6. DETAILS A AND B SHOW OPTIONAL VIEWS
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MATERIAL ALONG SIDE EDGE. MOLD
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE.
DIM
A1
A3
D2
E2
L1
A
D
K
b
E
e
L
3.3048
MILLIMETERS
MIN
0.80
0.00
0.18
2.40
1.70
0.35
0.00
0.20 REF
3.00 BSC
3.00 BSC
0.50 BSC
0.19 TYP
MAX
1.00
0.05
0.30
2.60
1.90
0.45
0.03
NCP1589A/D