MAX639CSA Maxim Integrated Products, MAX639CSA Datasheet - Page 11

• Manufacturer Part Number: MAX639CSA
• Description: IC CONV DC/DC 5V STEP DOWN 8SOIC
• Manufacturer: Maxim Integrated Products
• Type: Step-Down (Buck)r

Specifications of MAX639CSA

• Internal Switch(s): Yes
• Synchronous Rectifier: No
• Number Of Outputs: 1
• Voltage - Output: 5V, 1.3 ~ 11.5 V
• Current - Output: 225mA
• Voltage - Input: 4 ~ 11.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Power - Output: 471mW
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Frequency - Switching: -

Figure 6. Inverting Configuration
capacitor, even when the switch is off. This will usually not
be a problem for a 5V output at room temperature, since
the diode’s reverse leakage current and the feedback
resistors’ current typically drain the excess. However, if
the diode leakage is very low (which can occur at low
temperatures and/or small output voltages), charge may
build up on the output capacitor, making V
its set point. If this happens, add a small load resistor
(typically 1MΩ) to the output to pull a few extra
microamps of current from the output capacitor.
Several of the external components in a MAX639/
MAX640/MAX653 circuit experience peak currents up
to 600mA. Wherever one of these components con-
nects to ground, there is a potential for ground bounce.
Ground bounce occurs when high currents flow
through the parasitic resistances of PC board traces.
What one component interprets as ground can differ
from the IC’s ground by several millivolts. This may
increase the MAX639/MAX640/MAX653’s output ripple,
since the error comparator (which is referenced to
ground) will generate extra switching pulses when they
are not needed. It is essential that the input filter capac-
itor’s ground lead, the MAX639/MAX640/MAX653’s
GND pin, the diode’s anode, and the output filter
capacitor’s ground lead are as close together as possi-
ble, preferably at the same point. Figure 5 shows a
suggested through-hole printed circuit layout that mini-
mizes ground bounce.
Figure 6 shows the MAX639/MAX640/MAX653 in a
floating ground configuration. By tying what would nor-
mally be the output to the supply-voltage ground, the
IC’s GND pin is forced to a regulated -5V (MAX639),
V
IN
100µF
C
IN
______________________________________________________________________________________
GND
V+
6
4
MAX639
MAX640
MAX653
5V/3.3V/3V/Adjustable, High-Efficiency,
Low I
SHDN
VFB
Inverter Configuration
7
VOUT
8
LX
5
1
1N5817
Q
L = 100µH
OUT
, Step-Down DC-DC Converters
100µF
C
OUT
rise above
Layout
-5V
-3.3V
OR -3V
-3.3V (MAX640), or -3V (MAX653). Avoid exceeding the
maximum differential voltage of 11.5V from V+ to V
Other negative voltages can be generated by placing a
voltage divider across C
point to VFB in the same manner as the normal step-
down configuration.
For battery-powered applications, where the signal
ground does not have to correspond to the power-supply
ground, the circuit in Figure 6 generates 5V (MAX639),
3.3V (MAX640), or 3V (MAX653) from a pair of AA batter-
ies. Connect the V
and connect the output to your system’s ground input.
This configuration has the added advantage of reduced
on resistance, since the IC’s internal power FET has V
V
Figure 7. Maximum Current Capability of Figure 6 Circuit
Figure 8. Efficiency of Figure 6 Circuit
OUT
of gate drive (Figures 7 and 8).
Two AA Batteries to 5V, 3.3V, or 3V
87.0
86.5
86.0
85.5
85.0
84.5
84.0
160
140
120
100
80
60
40
20
0
1.5
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IN
1
ground point to your system’s input,
OUT
2
V+ (V)
V+ (V)
T
L = 100µH
MAX639
A
= +25°C
and connecting the tap
3
T
V
L = 470µH
I
OUT
A
OUT
= +25°C
= 10mA
= -5V
4
5
OUT
IN
11
+
.