HCPL-2219-360E Avago Technologies US Inc., HCPL-2219-360E Datasheet - Page 7

• Manufacturer Part Number: HCPL-2219-360E
• Description: OPTOCOUPLER 2.5MBD VDE 8-SMD GW
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-2219-360E

• Package / Case: 8-SMD Gull Wing
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 25mA
• Data Rate: 2.5MBd
• Propagation Delay High - Low @ If: 210ns @ 3mA
• Current - Dc Forward (if): 10mA
• Input Type: DC
• Output Type: Push-Pull, Totem-Pole
• Mounting Type: Surface Mount, Gull Wing
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 25 mA
• Maximum Fall Time: 15 ns
• Maximum Forward Diode Current: 10 mA
• Maximum Rise Time: 55 ns
• Output Device: Logic Gate Photo IC
• Configuration: 1 Channel
• Maximum Baud Rate: 5 MBps
• Maximum Forward Diode Voltage: 1.7 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Power Dissipation: 210 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Number Of Elements: 1
• Baud Rate: 5Mbps
• Forward Voltage: 1.7V
• Forward Current: 10mA
• Output Current: 25mA
• Package Type: PDIP SMD
• Operating Temp Range: 0C to 85C
• Power Dissipation: 210mW
• Propagation Delay Time: 300ns
• Pin Count: 8
• Mounting: Surface Mount
• Reverse Breakdown Voltage: 5V
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Recommended Operating Conditions
*The initial switching threshold is 1.6 mA or less. It is recommended that 2.2 mA be used to permit
at least a 20% CTR degradation guardband.
Absolute Maximum Ratings
(No Derating Required up to 70 C)
7
Parameter
Power Supply Voltage
Enable Voltage High
Enable Voltage Low
Forward Input Current
Forward Input Current
Operating Temperature
Fan Out
Parameter
Storage Temperature
Operating Temperature
Average Forward Input Current
Peak Transient Input Current
( 1 s Pulse Width, 300 pps)
Reverse Input Voltage
Average Output Current
Supply Voltage
Three State Enable Voltage
Output Voltage
Total Package Power Dissipation
Lead Solder Temperature
Solder Reflow Temperature Profile
Symbol
I
I
F(OFF)
F(ON)
V
V
V
T
N
CC
EH
EL
A
Min.
1.6*
4.5
2.0
0
–
0
Symbol
I
I
F(TRAN)
F(AVG)
V
T
T
V
V
V
P
I
CC
260 C for 10 sec., 1.6 mm below seating plane
O
A
R
O
S
E
T
Max.
85
See Package Outline Drawings section
0.8
0.1
20
20
5
4
[1]
TTL Loads
Min.
-0.5
-0.5
-55
-40
Units
0
mA
mA
V
V
V
C
Max.
125
210
1.0
85
10
25
20
20
20
5
Units
mW
mA
mA
A
V
V
V
V
C
C
Note
1
1