HCPL-7721-520 Avago Technologies US Inc., HCPL-7721-520 Datasheet - Page 5

• Manufacturer Part Number: HCPL-7721-520
• Description: OPTOCOUPLER 25MBD 6NS UL 8-SMD
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-7721-520

• Package / Case: 8-SMD Gull Wing
• Voltage - Isolation: 5000Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 10mA
• Data Rate: 25MBd
• Propagation Delay High - Low @ If: 20ns
• Input Type: Logic
• Output Type: Push-Pull, Totem-Pole
• Mounting Type: Surface Mount, Gull Wing
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 10 mA
• Maximum Fall Time: 8 ns
• Maximum Rise Time: 9 ns
• Output Device: Logic Gate Photo IC
• Configuration: 1 Channel
• Maximum Baud Rate: 25 MBps
• Maximum Power Dissipation: 150 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Number Of Elements: 1
• Output Current: 10mA
• Package Type: PDIP SMD
• Operating Temp Range: -40C to 85C
• Power Dissipation: 150mW
• Propagation Delay Time: 40ns
• Pin Count: 8
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

Solder Reflow Thermal Profile
Pb-Free IR Profile
Regulatory Information
The HCPL-772X/072X have been approved by the following organizations:
UL
Recognized under UL 1577, component recognition program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5, File CA88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884Teil 2):2003-01. (Option 060 only)
5
TEMPERATURE
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
Note: Non-halide flux should be used.
Note: Non-halide flux should be used.
T
T
smax
smax
smin
300
200
100
T
T
25
p
L
0
= 200 °C, T
0
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
50
s
260 +0/-5 °C
3°C + 1°C/–0.5°C
150°C, 90 + 30 SEC.
PREHEATING TIME
TIME
2.5°C ± 0.5°C/SEC.
100
t
TIME (SECONDS)
t
L
p
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250