HCPL-063N#500 Avago Technologies US Inc., HCPL-063N#500 Datasheet - Page 5

• Manufacturer Part Number: HCPL-063N#500
• Description: OPTOCOUPLER 2CH 10MBD 8-SOIC
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-063N#500

• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 50mA
• Data Rate: 10MBd
• Propagation Delay High - Low @ If: 53ns @ 3.5mA
• Current - Dc Forward (if): 10mA
• Input Type: DC
• Output Type: Open Collector
• Mounting Type: Surface Mount
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 50 mA
• Maximum Fall Time: 12 ns
• Maximum Forward Diode Current: 10 mA
• Maximum Rise Time: 42 ns
• Minimum Forward Diode Voltage: 1 V
• Output Device: Logic Gate Photo IC
• Configuration: 2 Channel
• Maximum Baud Rate: 10 MBps
• Maximum Forward Diode Voltage: 1.6 V
• Maximum Reverse Diode Voltage: 3 V
• Maximum Power Dissipation: 60 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Number Of Elements: 2
• Baud Rate: 10Mbps
• Forward Voltage: 1.6V
• Forward Current: 10mA
• Output Current: 50mA
• Package Type: SOIC
• Operating Temp Range: -40C to 85C
• Power Dissipation: 60mW
• Propagation Delay Time: 100ns
• Pin Count: 8
• Mounting: Surface Mount
• Reverse Breakdown Voltage: 3V
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

TEMPERATURE
HCPL-061A/061N/063A/063N Outline Drawing
Figure 3. 8-Pin Small Outline Package Device Drawing.
Recommended Pb-Free IR Profile
5
Solder Reflow Thermal Profile
Note: Non-halide flux should be used.
ROOM
(0.155 ± 0.005)
(0.016 ± 0.003)
3.937 ± 0.127
0.406 ± 0.076
(0.125 ± 0.005)
* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
3.175 ± 0.127
5.207 ± 0.254 (0.205 ± 0.010)
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
T
T
25
p
L
0
= 200 °C, T
0
150 - 200 °C
217 °C
Note: Non-halide flux should be used.
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
8
1
* 5.080 ± 0.127
(0.200 ± 0.005)
t 25 °C to PEAK
3 C/SEC. MAX.
60 to 180 SEC.
smin
7
2
PREHEAT
YWW
RAMP-UP
= 150 °C
XXX
6
3
t
s
50
260 +0/-5 °C
3°C + 1°C/–0.5°C
5
4
PREHEATING TIME
150°C, 90 + 30 SEC.
TIME
(0.050)
1.270
(0.236 ± 0.008)
(0.060)
5.994 ± 0.203
1.524
2.5 C ± 0.5°C/SEC.
BSC
t
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
t
L
p
100
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
TEMP.
PEAK
245°C
150
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
LAND PATTERN RECOMMENDATION
7
SEC.
SEC.
30
(0.012)
30
0.305
50 SEC.
MIN.
SOLDERING
0.64 (0.025)
45 X
200°C
TIME
200
(0.008 ± 0.004)
0.203 ± 0.102
PEAK
TEMP.
240°C
(0.017)
0.432
1.9 (0.075)
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
7.49 (0.295)
(0.009 ± 0.001)
0.228 ± 0.025
250
Regulatory Information
The HCPL-261A and HCPL-261N
families have been approved by the
following organizations:
UL
Recognized under UL 1577, Com-
ponent Recognition Program, File
E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
(Option 060 only)
Teil 2):2003-01.