H11F1M Fairchild Optoelectronics Group, H11F1M Datasheet

OPTOCOUPLER PHOTO FET 6DIP

H11F1M

Manufacturer Part Number
H11F1M
Description
OPTOCOUPLER PHOTO FET 6DIP
Manufacturer
Fairchild Optoelectronics Group
Datasheet

Specifications of H11F1M

Number Of Channels
1
Input Type
DC
Voltage - Isolation
5300Vrms
Voltage - Output
30V
Current - Dc Forward (if)
60mA
Output Type
Photo FET
Mounting Type
Through Hole
Package / Case
6-DIP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Output / Channel
-
Vce Saturation (max)
-
Current Transfer Ratio (max)
-
Current Transfer Ratio (min)
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
H11F1M
Manufacturer:
FSC
Quantity:
25 560
©2007 Fairchild Semiconductor Corporation
H11F1M, H11F2M, H11F3M Rev. 1.0.4
H11F1M, H11F2M, H11F3M
Photo FET Optocouplers
Features
As a remote variable resistor:
As an analog switch:
Applications
As a remote variable resistor:
As an analog switch:
Schematic
CATHODE
Extremely low offset voltage
60 V
No charge injection or latch-up
t
UL recognized (File #E90700)
Isolated variable attenuator
Automatic gain control
Active filter fine tuning/band switching
Isolated sample and hold circuit
Multiplexed, optically isolated A/D conversion
on
ANODE
100 to
15pF shunt capacitance
100G I/O isolation resistance
, t
off
pk-pk
15µS
signal capability
2
3
1
300M
6
5
4
OUTPUT
TERM.
OUTPUT
TERM.
General Description
The H11FXM series consists of a Gallium-Aluminum-
Arsenide IRED emitting diode coupled to a symmetrical
bilateral silicon photo-detector. The detector is electri-
cally isolated from the input and performs like an ideal
isolated FET designed for distortion-free control of low
level AC and DC analog signals. The H11FXM series
devices are mounted in dual in-line packages.
Package Outlines
September 2009
www.fairchildsemi.com

Related parts for H11F1M

H11F1M Summary of contents

Page 1

... CATHODE 2 3 ©2007 Fairchild Semiconductor Corporation H11F1M, H11F2M, H11F3M Rev. 1.0.4 General Description The H11FXM series consists of a Gallium-Aluminum- Arsenide IRED emitting diode coupled to a symmetrical bilateral silicon photo-detector. The detector is electri- cally isolated from the input and performs like an ideal isolated FET designed for distortion-free control of low level AC and DC analog signals ...

Page 2

... DETECTOR P Detector Power Dissipation @ 25°C D Derate linearly from 25°C BV Breakdown Voltage (either polarity) 4-6 I Continuous Detector Current (either polarity) 4-6 ©2007 Fairchild Semiconductor Corporation H11F1M, H11F2M, H11F3M Rev. 1.0 25°C unless otherwise specified) A Device H11F1M, H11F2M H11F3M 2 Value Units All -40 to +150 ° ...

Page 3

... Isolation Characteristics Symbol Characteristic V Isolation Voltage ISO R Isolation Resistance ISO C Isolation Capacitance ISO *All Typical values 25°C A ©2007 Fairchild Semiconductor Corporation H11F1M, H11F2M, H11F3M Rev. 1.0 25°C unless otherwise specified.) A Test Conditions Device I = 16mA All All 1.0MHz All I = 10µA, I ...

Page 4

... Max. Working Insulation Voltage IORM V Highest Allowable Over Voltage IOTM External Creepage External Clearance Insulation Thickness RIO Insulation Resistance at Ts, V ©2007 Fairchild Semiconductor Corporation H11F1M, H11F2M, H11F3M Rev. 1.0.4 Parameter , 100% Production Test PR , Type and Sample Test = 500V IO 4 Min. Typ. Max. ...

Page 5

... 1.2 1 100 C A 0.8 0 – LED FOR WARD CURRENT (mA) F ©2007 Fairchild Semiconductor Corporation H11F1M, H11F2M, H11F3M Rev. 1.0.4 800 600 400 200 0 -200 -400 -600 -800 100 Figure 4. Off-state Current vs. Ambient Temperature 10000 1000 100 100 0 Figure 5. Resistive Non-Linearity vs. D.C. Bias ...

Page 6

... The linearity of resistance and the low offset voltage of the H11FXM allows the remote tuning or band-switching of active filters without switching glitches or distortion. This schematic illustrates the concept, with current to the H11F1M IRED’s controlling the filter’s transfer characteristic. ©2007 Fairchild Semiconductor Corporation H11F1M, H11F2M, H11F3M Rev ...

Page 7

... Note: All dimensions in mm. ©2007 Fairchild Semiconductor Corporation H11F1M, H11F2M, H11F3M Rev. 1.0.4 0.4" Lead Spacing 6.10–6.60 7.62 (Typ.) 5.08 (Max.) 0.38 (Min.) 0.20–0.30 15° (Typ.) (0.86) 1.02–1.78 8.13– ...

Page 8

... TV SV SR2V Marking Information Definitions ©2007 Fairchild Semiconductor Corporation H11F1M, H11F2M, H11F3M Rev. 1.0.4 (Example) H11F1M Standard Through Hole Device H11F1SM Surface Mount Lead Bend H11F1SR2M Surface Mount; Tape and Reel H11F1VM IEC60747-5-2 approval H11F1TVM IEC60747-5-2 approval, 0.4" Lead Spacing H11F1SVM ...

Page 9

... Carrier Tape Specification 4.5 0.20 0.30 21.0 0.1 0.1 MAX User Direction of Feed ©2007 Fairchild Semiconductor Corporation H11F1M, H11F2M, H11F3M Rev. 1.0.4 12.0 0.1 2.0 0.05 0.05 4.0 0.1 10.1 0.20 9 Ø1.5 MIN 1.75 0.10 11.5 1.0 24.0 0.3 9.1 0.20 Ø ...

Page 10

... Maintained Above (T L Peak Body Package Temperature Time (t ) within 5°C of 260°C P Ramp-down Rate (T Time 25°C to Peak Temperature ©2007 Fairchild Semiconductor Corporation H11F1M, H11F2M, H11F3M Rev. 1.0.4 Max. Ramp-up Rate = 3°C/S Max. Ramp-down Rate = 6°C/S Tsmax Preheat Area Tsmin t s 120 240 Time 25° ...

Page 11

... Datasheet Identification Product Status Advance Information Formative / In Design Preliminary First Production No Identification Needed Full Production Obsolete Not In Production ©2007 Fairchild Semiconductor Corporation H11F1M, H11F2M, H11F3M Rev. 1.0.4 ® PowerTrench ® PowerXS™ SM Programmable Active Droop™ ® QFET QS™ Quiet Series™ ...

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