HCPL-4562-000E Avago Technologies US Inc., HCPL-4562-000E Datasheet - Page 5

• Manufacturer Part Number: HCPL-4562-000E
• Description: OPTOCOUPLER HI BAND 17MHZ 8DIP
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-4562-000E

• Input Type: DC
• Package / Case: 8-DIP (0.300", 7.62mm)
• Number Of Channels: 1
• Voltage - Isolation: 3750Vrms
• Voltage - Output: 20V
• Current - Output / Channel: 8mA
• Current - Dc Forward (if): 12mA
• Output Type: Transistor with Vcc
• Mounting Type: Through Hole
• Isolation Voltage: 3750 Vrms
• Minimum Forward Diode Voltage: 1.1 V
• Output Device: Transistor With Base
• Configuration: 1 Channel
• Current Transfer Ratio: 45 %(Typ)
• Maximum Forward Diode Voltage: 1.6 V
• Maximum Reverse Diode Voltage: 1.8 V
• Maximum Input Diode Current: 12 mA
• Maximum Power Dissipation: 100 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• No. Of Channels: 1
• Optocoupler Output Type: Phototransistor
• Input Current: 6mA
• Output Voltage: 20V
• Opto Case Style: DIP
• No. Of Pins: 8
• Rohs Compliant: Yes
• Input Current Max: 10mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Vce Saturation (max): -
• Current Transfer Ratio (max): -
• Current Transfer Ratio (min): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 516-1679-5

Solder Reflow Temperature Profile
Recommended Pb-Free IR Profile
Regulatory Information
The devices contained in this data sheet have been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5,
File CA 88324.
5
TEMPERATURE
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
Note: Non-halide flux should be used.
T
T
*
smax
smax
smin
400 mils package is 245°C
Recommended peak temperature for widebody
300
200
100
T
T
25
0
p
L
= 200 °C, T
0
Note: Non-halide flux should be used.
150 - 200 °C
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
t
s
50
*
260 +0/-5 °C
3°C + 1°C/–0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
TIME
2.5°C ± 0.5°C/SEC.
t
t
L
100
p
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
TEMP.
PEAK
245°C
150
SEC.
SEC.
30
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01
(HCNW4562 only)
30
50 SEC.
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250