HSMQ-C191 Avago Technologies US Inc., HSMQ-C191 Datasheet - Page 9

• Manufacturer Part Number: HSMQ-C191
• Description: LED CHIP INGAN GREEN DIFF SMD
• Manufacturer: Avago Technologies US Inc.
• Type: Uni-Colorr

Specifications of HSMQ-C191

• Package / Case: 0603 (1608 Metric)
• Viewing Angle: 140°
• Color: Green
• Millicandela Rating: 145mcd
• Current - Test: 20mA
• Wavelength - Dominant: 527nm
• Wavelength - Peak: 520nm
• Voltage - Forward (vf) Typ: 3.4V
• Lens Type: Diffused
• Lens Style/size: Rectangle, 1mm x 0.8mm
• Size / Dimension: 1.60mm L x 0.80mm W
• Height: 0.60mm
• Mounting Type: Surface Mount
• Resistance Tolerance: 527nm
• Led Size: 0603
• Illumination Color: Green
• Lens Color/style: Diffused
• Operating Voltage: 3.4 V
• Wavelength: 527 nm
• Luminous Intensity: 145 mcd
• Mounting Style: SMD/SMT
• Package Type: Chip Led
• Emitting Color: Green
• Test Current (it): 20mA
• Forward Current: 20mA
• Dominant Wave Length: 527nm
• Forward Voltage: 3.9V
• Product Length (mm): 1.6mm
• Product Height (mm): 0.8mm
• Product Depth (mm): 0.8mm
• Mounting: Surface Mount
• Peak Wavelength: 520nm
• Shape Type: Rectangular
• Chip Material: InGaN
• Main Category: Chip LED
• Number Of Elements: 1
• Pin Count: 2
• Operating Temperature Classification: Commercial
• Operating Temp Range: -30C to 85C
• Reverse Voltage: 5V
• Power Dissipation: 78mW
• Lens Dimensions: 1x0.8x0.3mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 516-1807-2; HSMQ-C191; Q2631034

9
Figure 11. Recommended reflow soldering profile.
Figure 13. Recommended soldering pattern for HSMx-C110.
Figure 15. Recommended soldering pattern for HSMx-
C130/190/191/197.
0.4 (0.016)
Figure 17. Recommended soldering pattern for HSMx-C120.
0.9 (0.035)
(0.031)
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
0.8
0.2 (0.008)
0.15 (0.006)
140-160°C
(0.028)
0.7
OVER 2 MIN.
10 SEC. MAX.
4°C/SEC.
230°C MAX.
(0.059)
MAX.
(0.031)
1.5
0.8
TIME
(0.031)
5.0 (0.200)
0.8
0.8 (0.031)
(0.079)
2.0
(0.047)
1.2
0.9 (0.035)
(0.059)
0.4 (0.016)
1.5
4°C/SEC. MAX.
(0.031)
3°C/SEC. MAX.
0.8
CENTERING
BOARD
1.0 (0.039)
CENTERING
BOARD
0.7 (0.028)
Figure 12. Recommended Pb-free reflow soldering profile.
Figure 14. Recommended soldering pattern for HSMx-C170/177.
Figure 16. Recommended soldering pattern for HSMx-C150.
Figure 18. Recommended soldering pattern for HSMx-C265.
(0.047)
(0.059)
1.2
1.5
217 C
200 C
150 C
(0.035)
(0.055)
0.9
1.4
(0.079)
2.0
(0.047)
1.2
3 C/SEC. MAX.
3 C/SEC. MAX.
60 - 120 SEC.
(0.091)
(0.059)
2.3
255 - 260 C
1.5
1.2 (0.047)
TIME
1.5 (0.059)
2.2 (0.087) DIA. PCB HOLE
(0.055)
1.4
10 SEC. MAX.
60 SEC. MAX.
6 C/SEC. MAX.
1.25 (0.049)