HLMP-4719 Avago Technologies US Inc., HLMP-4719 Datasheet - Page 8

• Manufacturer Part Number: HLMP-4719
• Description: LED 5MM 583NM YLW DIFF LOW CURR
• Manufacturer: Avago Technologies US Inc.
• Type: Uni-Colorr

Specifications of HLMP-4719

• Viewing Angle: 50°
• Package / Case: Radial - 2 Lead
• Color: Yellow
• Millicandela Rating: 2.1mcd
• Current - Test: 2mA
• Wavelength - Dominant: 585nm
• Voltage - Forward (vf) Typ: 1.8V
• Lens Type: Diffused, Yellow Tinted
• Lens Style/size: Round, 5mm, T-1 3/4
• Height: 8.81mm
• Mounting Type: Through Hole
• Resistance Tolerance: 585nm
• Led Size: T-1 3/4
• Illumination Color: Yellow
• Lens Color/style: Tinted Diffused
• Operating Voltage: 1.8 V
• Wavelength: 585 nm
• Luminous Intensity: 2.1 mcd
• Operating Current: 2 mA
• Lens Dimensions: 5 mm
• Lens Shape: Dome
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: Through Hole
• Color, Emitted: Yellow
• Finish, Lens: Diffused
• Package Type: 5 mm (T-13⁄4)
• Emitting Color: Amber
• Test Current (it): 2mA
• Forward Current: 7mA
• Dominant Wave Length: 585nm
• Forward Voltage: 2.5V
• Product Length (mm): 6.1mm
• Product Height (mm): 9.19mm
• Product Depth (mm): 6.1mm
• Mounting: Through Hole
• Peak Wavelength: 583nm
• Shape Type: Circular
• Chip Material: GaP
• Main Category: Standard LED
• Number Of Elements: 1
• Pin Count: 2
• Operating Temperature Classification: Industrial
• Operating Temp Range: -40C to 100C
• Reverse Voltage: 5V
• Power Dissipation: 17.5mW
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Wavelength - Peak: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 516-1326

Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
• For better control, it is recommended to use proper
• If manual lead cutting is necessary, cut the leads after
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
• LED component may be effectively hand soldered
• ESD precaution must be properly applied on the
• Recommended soldering condition:
8
Note:
1) Above conditions refers to measurement with thermocouple
2) It is recommended to use only bottom preheaters in order to
length prior to insertion and soldering on PC board.
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
process to prevent damage to the LED component.
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
Pre-heat Temperature 105°C Max.
Pre-heat Time
Peak Temperature
Dwell Time
mounted at the bottom of PCB.
reduce thermal stress experienced by LED.
1.59 mm
Wave
Soldering
60 sec Max.
250°C Max.
3 sec Max.
[1],[2]
Manual Solder
Dipping
–
–
260°C Max.
5 sec Max.
• Wave soldering parameters must be set and maintained
Note:
1. PCB with different size and design (component density) will have
2. Customer is advised to take extra precaution during wave soldering
• Any alignment fixture that is being applied during
• At elevated temperature, LED is more susceptible to
• If PCB board contains both through hole (TH) LED and
• Recommended PC board plated through holes (PTH)
• Over-sizing the PTH can lead to twisted LED after
Refer to application note AN5334 for more information
about soldering and handling of TH LED lamps.
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
to ensure that the maximum wave temperature does not exceed
250°C and the solder contact time does not exceeding 3sec. Over-
stressing the LED during soldering process might cause premature
failure to the LED due to delamination.
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
size for LED component leads.
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
LED Component
Lead Size
0.45 x 0.45 mm
(0.018 x 0.018 inch)
0.50 x 0.50 mm
(0.020 x 0.020 inch)
Diagonal
0.636 mm
(0.025 inch)
0.707 mm
(0.028 inch)
Plated Through
Hole Diameter
0.98 to 1.08 mm
(0.039 to 0.043 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)