HLMP-1540-H00VR Avago Technologies US Inc., HLMP-1540-H00VR Datasheet - Page 11

LED 3MM GAP GREEN CRIMPED LEADS

HLMP-1540-H00VR

Manufacturer Part Number
HLMP-1540-H00VR
Description
LED 3MM GAP GREEN CRIMPED LEADS
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HLMP-1540-H00VR

Viewing Angle
45°
Package / Case
Radial - 2 Lead
Color
Green
Millicandela Rating
45mcd
Current - Test
20mA
Wavelength - Dominant
569nm
Wavelength - Peak
565nm
Voltage - Forward (vf) Typ
2.2V
Lens Type
Clear
Lens Style/size
Round, 3mm, T-1
Height
4.70mm
Mounting Type
Through Hole
Resistance Tolerance
569nm
Led Size
T-1
Illumination Color
Green
Wavelength
569 nm
Mounting Style
Through Hole
Lead Free Status / RoHS Status
Not applicable / Not applicable
Luminous Flux @ Current - Test
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Not applicable / Not applicable

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HLMP-1540-H00VR
Manufacturer:
AVAGO
Quantity:
40 000
11
Example of Wave Soldering Temperature Profile for TH LED
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
DeptID:
(1P) Item: Part Number
(V) Vendor ID:
250
200
150
100
50
0
10
20
30
PREHEAT
TURBULENT WAVE
40
TIME (MINUTES)
Made In: Country of Origin
(9D) Date Code: Date Code
50
STANDARD LABEL LS0002
RoHS Compliant
e3
(Q) QTY: Quantity
BIN: Color Bin
CAT: Intensity Bin
60
max temp 250C
70
LAMINAR
80
HOT AIR KNIFE
90
100
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.

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