SOCKET TRAN ICE 80MQFP/TQFP

XLT80PT3

Manufacturer Part NumberXLT80PT3
DescriptionSOCKET TRAN ICE 80MQFP/TQFP
ManufacturerMicrochip Technology
XLT80PT3 datasheets
 

Specifications of XLT80PT3

Module/board Type*ProductMicrocontroller Accessories
Lead Free Status / RoHS StatusLead free / RoHS CompliantFor Use With/related ProductsMPLAB™ICE
For Use WithDAF18-6 - DEVICE ADAPTER FOR ICE4000DVA1003 - DEVICE ADAPTER FOR ICE2000DVA18PQ802 - DEVICE ATP FOR ICE2000DAF30-2 - DEVICE ATP FOR ICE4000DVA18PQ800 - ADAPTER DEVICE ICE 80TQFPDVA17PQ801 - DEVICE ADAPTER FOR PIC17C762Other namesXLT80PT3R
XLT80PT3R
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Transition Socket Specification
QFP TRANSITION SOCKET
QFP (MQFP, TQFP, PQFP) transition sockets and
associated hardware are shown below.
FIGURE 4: QFP TRANSITION SOCKET
Cable to Processor Module
QFP Device Adapter
QFP Transition Socket
Target/Application Board
The QFP transition socket is required for use along with
the QFP device adapter. The device adapter is
equipped with four socket strips that interface with the
transition socket.
Note:
To avoid solder bridging, do not place vias
within 0.025-inch of the QFP footprint.
Also, any vias near the QFP should be
directly on the centerline of the pad.
There are two parts to the QFP transition socket:
1.
Adapter socket that connects to the QFP device
adapter
2.
QFP header that gets soldered down to the
target application
Microchip offers the following QFP transition sockets:
• XLT44PT3: One 44-lead QFP adapter socket and
one 44-lead QFP header (0.8 mm)
• XLT64PT5: One 64-lead QFP adapter socket and
one 64-lead QFP header (0.5 mm)
• XLT80PT2: One 80-lead QFP adapter socket and
one 80-lead QFP header (0.65 mm)
• XLT80PT3: One 80-lead QFP adapter socket and
one 80-lead QFP header (0.5 mm)
See the drawings in this section for layout dimensions
and clearances for tall components.
 2010 Microchip Technology Inc.
QFP TRANSITION SOCKET
SOLDERING TIPS
• Use controlled soldering iron tip temperatures
between 300C and 325C (570F to 615F)
• If possible, use a PACE mini wave soldering iron
tip or an equivalent tip design.
• Plan to solder one (1 of 4) side first, then the
opposite side, then the remaining two sides.
• Soldering iron tip movement should be in the
direction of the leads (backward and forward), not
across the leads; dragging the tip across the
leads may cause lead damage.
• Use generous amounts of soldering flux to aid in
the solder flow action.
DS51194S-page 17