ACS9550EVB Semtech, ACS9550EVB Datasheet - Page 3

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ACS9550EVB

Manufacturer Part Number
ACS9550EVB
Description
EVALUATION BOARD FOR ACS9550
Manufacturer
Semtech
Series
ToPSync™r
Datasheet

Specifications of ACS9550EVB

Main Purpose
Timing, Timing-over-Packet Synchronization
Embedded
No
Utilized Ic / Part
ACS9550
Primary Attributes
Precision Time Protocol (PTP)
Secondary Attributes
IEEE1588 Slave
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ACS9550TPB_US, Revision 04, February 2010
©2010 Semtech Corp.
ADVANCED COMMS & SENSING
Block diagram of the ACS9550T
ACS9550T package information
(LASER MARK)
A1 CORNER
bbb C
aaa C
INDEX
PIN 1
NOTES:
1.
2.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
"M" REPRESENTS THE BASIC SOLDER BALL MATRIX SIZE AND
"N" IS THE NUMBER OF ATTACHED SOLDER BALLS.
A
E1
A
W
SEE DETAIL
DETAIL A
1
D
D1
B
A1
19
C
SEATING
PLANE
Page 3
B
E
SEE DETAIL
e
DETAIL B
A
DIM
aaa
bbb
ccc
ddd
A
A1
D
D1
E
E1
M
N
f
b
e
f
DIMENSIONS
19.80
19.80
MIN
1.48
0.40
0.52
f
MILLIMETERS
-
-
-
-
-
Ø bxN
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION
THE PRE-FLOW CONDITION
IS Ø0.60mm
18.00 BSC
18.00 BSC
1.00 BSC
NOM
20.00
20.00
1.00
1.56
0.50
0.62
360
19
-
-
-
-
ccc
ddd
20.20
20.20
MAX
0.20
0.25
0.25
0.10
1.64
0.60
0.72
-
C A B
C
FINAL PRODUCT BRIEF
ToPSync™
www.semtech.com
ACS9550T

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