MAX17007EVKIT+ Maxim Integrated Products, MAX17007EVKIT+ Datasheet - Page 34

• Manufacturer Part Number: MAX17007EVKIT+
• Description: KIT EVAL FOR MAX17007
• Manufacturer: Maxim Integrated Products
• Series: Quick-PWM™r

Specifications of MAX17007EVKIT+

• Main Purpose: DC/DC, Step Down
• Outputs And Type: 2, Non-Isolated
• Voltage - Output: 1.2V, 1.5V
• Current - Output: 12A, 12A
• Voltage - Input: 7 ~ 24V
• Regulator Topology: Buck
• Frequency - Switching: 270kHz, 330kHz
• Board Type: Fully Populated
• Utilized Ic / Part: MAX17007
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

3) Group the gate-drive components (BST capacitors,
4) Make the DC-DC controller ground connections as
Figure 15. PCB Layout Example
Dual and Combinable QPWM Graphics
Core Controllers for Notebook Computers
34
V
shown in Figures 1 and 2. This diagram can be
viewed as having four separate ground planes: I/O
ground, where all the high-power components go;
the power ground plane, where the PGND pin and
V
ground plane where sensitive analog components,
the master’s GND pin, and V
go; and the slave’s analog ground plane where the
slave’s GND pin and V
master’s GND plane must meet the PGND plane
only at a single point directly beneath the IC.
Similarly, the slave’s GND plane must meet the
PGND plane only at a single point directly beneath
______________________________________________________________________________________
DD
DD
bypass capacitor) together near the controller IC.
bypass capacitor go; the master’s analog
INDUCTOR
EXPOSED PAD TO
L1
CONNECT THE
ANALOG GND
VIA TO POWER
SMPS1
GROUND
V
CAPACITOR
CC
CC
POWER STAGE LAYOUT (TOP SIDE OF PCB)
BYPASS
OUTPUT 1
bypass capacitor go. The
CC
POWER GROUND
VIA TO ANALOG
bypass capacitor
GROUND
INPUT
+
OUTPUT 2
X-RAY VIEW.
IC MOUNTED
ON BOTTOM
SIDE OF PCB.
REF BYPASS
CAPACITOR
CONNECT GND AND PGND THE
CONTROLLER AT ONE POINT
ONLY AS SHOWN
SMPS2
IC LAYOUT
5) Connect the output power planes (V
INDUCTOR
L2
the IC. The respective master and slave ground
planes should connect to the high-power output
ground with a short metal trace from PGND to the
source of the low-side MOSFET (the middle of the
star ground). This point must also be very close to
the output capacitor ground terminal.
tem ground planes) directly to the output filter
capacitor positive and negative terminals with multi-
ple vias. Place the entire DC-DC converter circuit
as close to the load as is practical. See Figure 15.
(SEE MAX17007 EVALUATION KIT)
UNDER THE INDUCTOR
KELVIN SENSE VIAS
INDUCTOR DCR SENSING
KELVIN SENSE VIAS TO
INDUCTOR PAD
CSL
CSH
OUT
and sys-