MAX15041EVKIT+ Maxim Integrated Products, MAX15041EVKIT+ Datasheet - Page 2

• Manufacturer Part Number: MAX15041EVKIT+
• Description: KIT EVAL MAX15041ETE
• Manufacturer: Maxim Integrated Products
• Type: DC/DC Switching Converters, Regulators & Controllersr

Specifications of MAX15041EVKIT+

• Board Size: 55 mm x 55 mm
• Operating Supply Voltage: 4.5 V to 28 V
• Product: Power Management Development Tools
• Dimensions: 55 mm x 55 mm
• Silicon Manufacturer: Maxim
• Silicon Core Number: MAX15041
• Kit Application Type: Power Management
• Application Sub Type: Synchronous Buck Converter
• Kit Contents: Board
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: MAX15041

Low-Cost, 3A, 4.5V to 28V Input, 350kHz, PWM
Step-Down DC-DC Regulator with Internal Switches
ABSOLUTE MAXIMUM RATINGS
IN to SGND.............................................................-0.3V to +30V
EN to SGND .................................................-0.3V to (V
LX to PGND ................................-0.3V to min (+30V, V
LX to PGND .....................-1V to min (+30V, V
PGOOD to SGND .....................................................-0.3V to +6V
V
COMP, FB, SS to SGND..............-0.3V to min (+6V, V
BST to LX .................................................................-0.3V to +6V
BST to SGND .........................................................-0.3V to +36V
SGND to PGND ....................................................-0.3V to +0.3V
PACKAGE THERMAL CHARACTERISTICS (Note 2)
ELECTRICAL CHARACTERISTICS
(V
Note 1: LX has internal clamp diodes to PGND and IN. Applications that forward bias these diodes should take care not to exceed
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
16 TQFN-EP
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
2
DD
STEP-DOWN CONVERTER
Input-Voltage Range
Quiescent Current
Shutdown Input Supply Current
ENABLE INPUT
EN Shutdown Threshold Voltage
EN Shutdown Voltage Hysteresis
EN Lockout Threshold Voltage
EN Input Current
POWER-GOOD OUTPUT
PGOOD Threshold
PGOOD Threshold Hysteresis
PGOOD Output Low Voltage
PGOOD Leakage Current
ERROR AMPLIFIER
Error Amplifier
Transconductance
Error Amplifier Voltage Gain
FB Set-Point Accuracy
IN
Junction-to-Ambient Thermal Resistance (
Junction-to-Case Thermal Resistance (
_______________________________________________________________________________________
= 12V, C
to SGND............................................................-0.3V to +6V
the IC’s package power dissipation.
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
VDD
= 1µF, C
IN
= 22µF, T
V
V
EN_LOCK_HYST
A
V
V
PGOOD_HYST
V
V
V
SYMBOL
PGOOD_TH
PGOOD_OL
= T
I
EN_SHDN
EN_LOCK
EN_HYST
PGOOD
A
JC
g
V
V
I
I
VEA
J
EN
MV
IN
FB
IN
IN
) ...............+7°C/W
= -40°C to +85°C, typical values are at T
JA
+ 0.3V) for 50ns
).........+48°C/W
DD
IN
IN
Not switching
V
LDO
V
V
V
V
V
I
V
PGOOD
+ 0.3V)
+ 0.3V)
+ 0.3V)
EN
EN
EN
EN
EN
FB
PGOOD
rising
= 0V, V
= 0V, V
rising
rising
= 2.9V
= 5mA, V
= 5V, V
DD
IN
CONDITIONS
= V
LX Current (Note 1) ....................................................-5A to +8A
Converter Output Short-Circuit Duration ...................Continuous
Continuous Power Dissipation (T
Operating Temperature Range ..........................-40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range ............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
regulated by internal
FB
16-Pin TQFN (derate 14.7mW/°C above +70°C)
Multilayer Board .........................................................1666mW
FB
DD
= 0.7V
= 0.5V
= 5V
A
= +25°C, unless otherwise noted.) (Note 3)
MIN
540
600
4.5
1.7
2
A
= +70°C)
TYP
1.95
100
100
560
606
2.1
1.4
5.3
1.6
18
15
35
10
90
2
MAX
2.15
584
100
612
28
12
28
4
9
UNITS
mA
mV
mV
mV
mV
mV
mS
mV
µA
µA
nA
dB
V
V
V