TMPSNS-RTD1 Microchip Technology, TMPSNS-RTD1 Datasheet - Page 24

• Manufacturer Part Number: TMPSNS-RTD1
• Description: BOARD EVAL PT100 RTD TEMP SENSOR
• Manufacturer: Microchip Technology

Specifications of TMPSNS-RTD1

• Sensor Type: Temperature
• Interface: USB
• Embedded: Yes, MCU, 8-Bit
• Utilized Ic / Part: MCP3301, MCP6S26, PIC18F2550
• Processor To Be Evaluated: MCP6S26, MCP3301, MCP6024, MCP41010, PIC18F2550, TC1071, MCP6002
• Data Bus Width: 12 bit
• Interface Type: USB
• Lead Free Status / RoHS Status: Not applicable / Not applicable
• Voltage - Supply: -
• Sensitivity: -
• Sensing Range: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Not applicable / Not applicable

MCP3301
8-Lead Plastic Micro Small Outline Package (MS) [MSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
DS21700C-page 24
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
1
N
b
2
D
e
E1
A2
Dimension Limits
E
c
Units
A2
A1
E1
L1
N
A
E
D
e
L
φ
c
b
0.75
0.00
0.40
0.08
0.22
MIN
0°
–
L1
MILLIMETERS
0.65 BSC
4.90 BSC
3.00 BSC
3.00 BSC
0.95 REF
NOM
0.60
0.85
8
–
–
–
–
–
Microchip Technology Drawing C04-111B
© 2007 Microchip Technology Inc.
MAX
1.10
0.95
0.15
0.80
0.23
0.40
8°
L
φ