STEVAL-IFS003V1 STMicroelectronics, STEVAL-IFS003V1 Datasheet - Page 152

• Manufacturer Part Number: STEVAL-IFS003V1
• Description: BOARD STLM75/STDS75/ST72F651
• Manufacturer: STMicroelectronics

Specifications of STEVAL-IFS003V1

• Design Resources: STEVAL-IFS003V1 Gerber Files STEVAL-IFS003V1 Schematic STEVAL-IFS003V1 Bill of Materials
• Sensor Type: Temperature
• Sensing Range: -55°C ~ 125°C
• Interface: I²C
• Voltage - Supply: 7.5 V ~ 19 V
• Embedded: Yes, MCU, 8-Bit
• Utilized Ic / Part: ST72F651, STDS75, STLM75
• Silicon Manufacturer: ST Micro
• Silicon Core Number: STLM75/STDS75 And ST72F651AR6
• Kit Application Type: Sensing - Temperature
• Application Sub Type: Temperature Sensor
• Kit Contents: Board
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Sensitivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-6238

ST72651AR6
14.2 THERMAL CHARACTERISTICS
Notes:
1.
tion of an application can be defined by the user with the formula: P
internal power (I
plication.
2.
152/161
The maximum power dissipation is obtained from the formula P
The maximum chip-junction temperature is based on technology characteristics.
Symbol
T
R
P
Jmax
thJA
D
DD
xV
DD
Package thermal resistance (junction to ambient)
Power dissipation
Maximum junction temperature
) and P
PORT
is the port power dissipation depending on the ports used in the ap-
1)
Ratings
Doc ID 7215 Rev 4
2)
LQFP64 (10x10)
D
D
= (T
=P
INT
J
-T
+P
A
) / R
PORT
Value
thJA
150
500
50
where P
. The power dissipa-
INT
is the chip
°C/W
Unit
mW
°C