CYII4SC014K-EVAL Cypress Semiconductor Corp, CYII4SC014K-EVAL Datasheet - Page 25

• Manufacturer Part Number: CYII4SC014K-EVAL
• Description: BOARD EVAL IMAG SENS IBIS4-14000
• Manufacturer: Cypress Semiconductor Corp

Specifications of CYII4SC014K-EVAL

• Sensor Type: CMOS Imaging, Color (RGB)
• Sensing Range: 14 Megapixel
• Interface: SPI
• Sensitivity: 3 fps
• Voltage - Supply: 3.3V
• Embedded: No
• Utilized Ic / Part: IBIS4-14000
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

Specification
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Defects (digs, scratches) are detected at final test using F/11
light source. Glass defects that do not generate non correctable
pixels are accepted.
Storage and Handling
Storage Conditions
Note: RH = Relative Humidity
Handling Precautions
Special care should be taken when soldering image sensors with
color filter arrays (RGB color filters) onto a circuit board becasue
color filters are sensitive to high temperatures. Prolonged
heating at elevated temperatures can result in deterioration of
the performance of the sensor. The following recommendations
are made to ensure that sensor performance is not compromised
during users’ assembly processes.
ESD
Though not as sensitive as CCD sensors, the IBIS4-14000 is
vulnerable to ESD like other standard CMOS devices. Device
placement onto boards must be done in accordance with strict
ESD controls for Class 0, JESD22 Human Body Model, and
Class A, JESD22 Machine Model devices. Take into account
standard ESD procedures when manipulating the device:
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Table 14. Chemical Substances and Information about Any Intentional Content
Document #: 38-05709 Rev. *D
Temperature
Temperature
Lead
Cadmium
Mercury
Hexavalent chromium
PBB (Polybrominated biphenyls)
PBDE (Polybrominated diphenyl ethers)
Description Minimum Maximum Unit
AR coating: 400–690 nm R < 1.5%
Dig, haze, scratch 20 µm after coating
Substrate: Schott S8612 glass
Thickness: 0.7 mm ±0.050 mm
Size: 31.9 x 44.9 mm
Assembly operators should always wear all designated and
approved grounding equipment. Grounded wrist straps at ESD
Chemical Substance
–10
–10
2
±0.2 mm
66
38
°C
°C
Conditions
@ 15% RH
@ 86% RH
Any intentional
content?
NO
NO
NO
NO
NO
NO
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Dust and Contamination
Dust or contamination of the glass surface can deteriorate the
output characteristics or cause a scar. In order to minimize dust
or contamination on the glass surface, take the following precau-
tions:
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Soldering
Soldering should be manually performed with 5 seconds at
350°C maximum at the tip of the soldering iron.
Precautions and Cleaning
Avoid spilling solder flux on the cover glass; bare glass and
particularly glass with anti reflection filters can adversely affected
by the flux. Avoid mechanical or particulate damage to the cover
glass. Avoid mechanical stress when mounting the device.
RoHS (Pb-free) Compliance
This section reports the use of Hazardous chemical substances
as required by the RoHS Directive (excluding packing material).
protected workstations are recommended including the use of
ionized blowers. All tools should be ESD protected. To ground
the human body, provide a resistance of 1 MOhm between the
human body and the ground to be on the safe side.
When directly handling the device with the fingers, hold the part
without the leads and do not touch any lead.
To avoid generating static electricity:
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When storing or transporting the device, put it in a container of
conductive material.
Handle the device in a clean environment such as a cleaned
booth (the cleanliness should be, if possible, class 100).
Do not touch the glass surface with the fingers.
Use gloves to manipulate the device.
Do not scrub the glass surface with cloth or plastic.
Do not attach any tape or labels.
Do not clean the glass surface with dust cleaning tape.
If there is any intentional content,
in which portion is it contained?
CYII4SM014KAA-GEC
CYII4SC014KAA-GTC
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