CRA04P083100RJTD Vishay, CRA04P083100RJTD Datasheet - Page 3

• Manufacturer Part Number: CRA04P083100RJTD
• Description: RES ARRAY 100 OHM 8TRM 4RES SMD
• Manufacturer: Vishay
• Series: CRA04r

Specifications of CRA04P083100RJTD

• Resistance (ohms): 100
• Number Of Resistors: 4
• Circuit Type: Isolated
• Temperature Coefficient: ±200ppm/°C
• Tolerance: ±5%
• Power Per Element: 62.5mW
• Number Of Pins: 8
• Package / Case: 0804 (2010 Metric), Concave
• Size / Dimension: 0.079" L x 0.039" W (2.00mm x 1.00mm)
• Height: 0.018" (0.45mm)
• Mounting Type: Surface Mount
• Operating Temperature: -55°C ~ 155°C
• Lead Free Status / RoHS Status: Lead free by exemption / RoHS Compliant
• Other names: CRA4P8100TR

www.vishay.com
240
CRA04P
Vishay
Note
(1)
All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2 environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3
CLAUSE
60115-1
TEST PROCEDURES AND REQUIREMENTS
4.5
4.7
4.13
4.17.2
4.8.4.2
4.32
4.33
4.19
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
4.25.1
4.18.2
4.35
4.24
4.25.3
4.40
4.29
4.30
4.22
4.37
4.27
Figures are given for a single element
EN
METHOD
78 (Cab)
60068-2
21 (U
21 (U
45 (XA)
45 (XA)
58 (Td)
14 (Na)
30 (Db)
30 (Db)
58 (Td)
13 (M)
2 (Ba)
1 (Aa)
TEST
6 (Fc)
IEC
-
-
-
-
-
-
-
-
-
-
-
-
U3
U1
)
)
Single pulse high voltage overload,
Vibration, endurance by sweeping
Flammability, needle flame test
Component solvent resistance
Solvent resistance of marking
Rapid change of temperature
Resistance to soldering heat
upper category temperature
Periodic electric overload
Damp heat, steady state
Temperature coefficient
Electrostatic discharge
(human body model)
Endurance at 70 °C
Short time overload
Substrate bending
Damp heat, cyclic
Damp heat, cyclic
Shear (adhesion)
Low air pressure
Voltage proof
Endurance at
10 µs/700 µs
Solderability
Resistance
D.C. load
Dry heat
TEST
Cold
-
For Technical Questions contact:
Thick Film, Resistor Array
Solder bath method; (260 ± 5) °C; (10 ± 1) s
non-activated flux; (235 ± 5) °C; (2 ± 0.2) s
non-activated flux; (245 ± 5) °C; (3 ± 0.3) s
discharges; ESD voltage according to style
Stability for product type:
IEC 61340-3-1; 3 positive and 3 negative
≤ 2 × U
Solder bath method; Sn96.5Ag3Cu0.5;
f = 10 Hz to 2000 Hz; x, y, z ≤ 1.5 mm;
30 min. at - 55 °C; 30 min at 125 °C
(40 ± 2) °C; (93 ± 3) % RH; 56 days
Isopropyl alcohol; 50 °C; method 1;
(20/- 55/20) °C and (20/125/20) °C
Isopropyl alcohol; 50 °C; method 2
A ≤ 200 m/s
U
Solder bath method; Sn60Pb40;
Û
55 °C; ≥ 90 % RH; 24 h; 1 cycle
55 °C; ≥ 90 % RH; 24 h; 5 cycle
0.1 s on; 2.5 s off; 1000 cycles
=
=
max.
1 kPa; (25 ± 10) °C; 1 h
U
10 x
IEC 60695-11-5; 10 s
Depth 2 mm; 3 times
U
15 x P
U = 1.4 x U
1.5 h on; 0.5 h off;
=
; Duration according to style
U
=
155 °C; 1000 h
[e-mail]
PROCEDURE
70 °C; 1000 h
70 °C; 8000 h
125 °C; 16 h
1000 cycles
- 55 °C; 2 h
toothbrush
2.5 x
=
P
2
10 pulses
5 cycles
P
; 10 sweeps per axis
70
70
45 N
70
P
-
-
x R
x R
x R
70
ins
P
x R
; 60 s
≤
70
≤
≤
U
2 x U
2 x U
x R
max.
CRA04P
max.
max.
STABILITY CLASS 2 OR BETTER
REQUIREMENTS PERMISSIBLE
10 Ω to 1 MΩ
± 100 ppm/K
Good tinning (≥ 95 % covered)
Good tinning (≥ 95 % covered)
no open circuit in bent position
No flashover or breakdown
± 2 %
± (0.25 % R + 0.05 Ω)
No burning after 30 s
± (0.5 % R + 0.05 Ω)
± (0.5 % R + 0.05 Ω)
± (0.5 % R + 0.05 Ω)
± (0.5 % R + 0.05 Ω)
No visible damage,
± (1 % R + 0.05 Ω)
± (2 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
No visible damage
No visible damage
no visible damage
no visible damage
no visible damage
± (2 % R + 0.1 Ω)
± (4 % R + 0.1 Ω)
± (2 % R + 0.1 Ω)
CHANGE (ΔR)
Marking legible,
Document Number: 31048
Revision: 29-Mar-10
± 200 ppm/K
1 Ω to 1 MΩ
± 5 %
(1)