4816P-1-221LF Bourns Inc., 4816P-1-221LF Datasheet

RES NET ISOLATED 220 OHM 16-SMD

4816P-1-221LF

Manufacturer Part Number
4816P-1-221LF
Description
RES NET ISOLATED 220 OHM 16-SMD
Manufacturer
Bourns Inc.
Series
4800Pr
Type
Networkr
Datasheets

Specifications of 4816P-1-221LF

Temperature Coefficient
±100ppm/°C
Resistance (ohms)
220
Number Of Resistors
8
Circuit Type
Isolated
Tolerance
±2%
Power Per Element
160mW
Number Of Pins
16
Package / Case
16-SOIC (0.220", 5.59mm Width)
Size / Dimension
0.440" L x 0.220" W (11.18mm x 5.59mm)
Height
0.080" (2.03mm)
Mounting Type
Surface Mount
Operating Temperature
-55°C ~ 125°C
Resistance
220ohm
Resistance Tolerance
± 2%
Power Rating
1.28W
Voltage Rating
50V
No. Of Elements
8
Network Circuit Type
Isolated
Package Type
SMT
Product Type
Networks
Resistor Values
220 Ohms
Operating Temperature Range
- 55 C to + 125 C
Dimensions
7.62 mm W x 9.53 mm L x 2.03 mm H
Lead Spacing
1.27 mm
Termination Style
SMD/SMT
Body Material
Thermoplastic
Technology
Thick Film
Power Rating Per Resistor
4/25W
Tolerance (+ Or -)
2%
Circuit Designator
ISOL
Mounting Style
Surface Mount
Military Standard
Not Required
Operating Temp Range
-55C to 125C
No. Of Terminals
16
Case Style
Molded
Failure Rate
Not Required
Terminal Pitch
1.27
Product Length (mm)
11.18mm
Product Depth (mm)
7.62mm
Product Height (mm)
2.03mm
No. Of Pins
16
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
August, 2007
Bourns Manufacturers Representatives
Corporate Distributor Product Managers
Americas Sales Team
Asia Sales Team
Europe Sales Team
Bourns Internal
Bourns Plant Managers
Effective with shipments beginning October 1, 2007 (date code C0740), we are making a running
change to the terminal finish on the surface mount Resistor Network Model Series 4400P, 4800P,
and 4800T. The finish is applied after molding and forming of the terminals.
Currently the hot solder dip process uses a 96.5 % Sn 3 % Ag 0.5 % Cu alloy.
The new hot solder dip process will use a 99.3 % Sn 0.7 % Cu alloy.
Both alloys are backwards compatible with SnPb soldering processes.
As a result of the alloy change, the labeling on our RoHS page on our website and on the shipping label
will also change in accordance with the industry “JEDEC STANDARD JESD97: Marking, Symbols and
Labels for Identification of Lead (Pb) Free Assemblies, Components, and Devices”.
Terminal finish code:
Current marking:
After the change:
Note: All of the product in any package will contain the same finish process and will
Surface Mount Networks Model Series 4400 & 4800
have the same “e” value applied.
Terminal Finish Material Change
R E S I S T O R N E T W O R K S
e1 – SnAgCu
e2 – Sn alloys with no Bi or Zn excluding SnAgCu
N0706
4400T

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