AU016D104KAG2A AVX Corporation, AU016D104KAG2A Datasheet - Page 5

• Manufacturer Part Number: AU016D104KAG2A
• Description: CAP CER .10UF 6.3V X5R GOLD 0201
• Manufacturer: AVX Corporation
• Series: AUr

Specifications of AU016D104KAG2A

• Capacitance: 0.1µF
• Voltage - Rated: 6.3V
• Tolerance: ±10%
• Temperature Coefficient: X5R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 85°C
• Applications: General Purpose
• Package / Case: 0201 (0603 Metric)
• Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
• Dielectric Characteristic: X5R
• Capacitance Tolerance: ± 10%
• Voltage Rating: 6.3VDC
• No. Of Pins: 2
• Capacitor Mounting: SMD
• Operating Temperature Range: -55°C To +85°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MLCC Gold Termination – AU Series
Capacitance Range (X7R Dielectric)
PREFERRED SIZES ARE SHADED
(L) Length
(W) Width
(t) Terminal
* Contact factory
34
Thickness
Cap
(pF)
Cap
(μF
Letter
Max.
Packaging
Soldering
SIZE
SIZE
WVDC
WVDC
0.010
0.015
0.022
0.033
0.047
0.068
1000
1500
2200
3300
4700
6800
(0.013)
0.10
0.15
0.22
0.33
0.47
0.68
100
150
220
330
470
680
100
0.33
1.0
1.5
2.2
3.3
4.7
10
22
47
mm
mm
mm
(in.)
(in.)
(in.)
A
10
10
M
M
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
X
X
X
Z
Z
(0.022)
0.56
C
16
16
M
M
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
X
X
X
Z
Z
PAPER
(0.028)
0.71
E
25
25
M
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
P
P
Z
Z
Z
Z
Z
Paper/Embossed
Reflow/Epoxy/
(0.126 ± 0.008)
(0.098 ± 0.008)
(0.020 ± 0.010)
Wire Bond*
3.20 ± 0.20
2.50 ± 0.20
0.50 ± 0.25
AU10
AU10
(0.035)
0.90
50
50
M
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
X
X
Z
Z
Z
Z
G
100
100
M
P
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
X
Z
Z
Z
(0.037)
0.94
J
200
200
M
M
J
J
J
J
J
J
J
J
J
J
Z
Z
(0.040)
1.02
K
500
500
M
M
M
M
M
M
P
Q
Q
(0.050)
50
50
M
M
1.27
K
K
K
K
K
K
K
K
K
K
K
Z
Z
Z
Z
M
Reflow/Epoxy/
All Embossed
(0.177 ± 0.012)
(0.126 ± 0.008)
(0.024 ± 0.014)
100
100
Wire Bond*
M
Q
K
K
K
K
K
K
K
K
K
P
X
Z
Z
4.50 ± 0.30
3.20 ± 0.20
0.61 ± 0.36
(0.055)
AU12
AU12
1.40
N
200
200
K
K
K
K
K
K
K
P
P
X
(0.060)
1.52
EMBOSSED
P
500
500
K
P
P
X
Z
Z
Z
Reflow/Epoxy/ Reflow/Epoxy/
All Embossed
(0.177 ± 0.012)
(0.252 ± 0.016)
(0.024 ± 0.014)
(0.070)
Wire Bond*
L
50
50
M
M
M
M
M
M
M
M
M
M
M
M
M
M
1.78
4.50 ± 0.30
6.40 ± 0.40
0.61 ± 0.36
Q
AU13
AU13
100
100
t
M
M
M
M
M
M
M
M
M
M
M
P
P
(0.090)
2.29
X
All Embossed
(0.225 ± 0.010)
(0.250 ± 0.010)
(0.025 ± 0.015)
Wire Bond*
50
50
5.72 ± 0.25
6.35 ± 0.25
0.64 ± 0.39
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
W
AU14
AU14
(0.100)
2.54
T
100
100
Y
P
P
P
P
P
P
P
P
P
P
P
P
P
X
(0.110)
2.79
Z