A700X337M002ATE015 Kemet, A700X337M002ATE015 Datasheet - Page 11

• Manufacturer Part Number: A700X337M002ATE015
• Description: CAP AO TYPE 330UF 2V 20% SMD
• Manufacturer: Kemet
• Series: AO-Cap A700r

Specifications of A700X337M002ATE015

• Capacitance: 330µF
• Voltage Rating: 2V
• Tolerance: ±20%
• Operating Temperature: -55°C ~ 125°C
• Features: Polymer
• Ripple Current: 3.9A
• Esr (equivalent Series Resistance): 15.0 mOhm
• Mounting Type: Surface Mount
• Package / Case: 2917 (7343 Metric)
• Size / Dimension: 0.287" L x 0.169" W (7.30mm x 4.30mm)
• Height: 0.157" (4.00mm)
• Surface Mount Land Size: 0.287" L x 0.169" W (7.30mm x 4.30mm)
• Esr: 15 mOhms
• Operating Temperature Range: - 55 C to + 125 C
• Termination Style: SMD/SMT
• Dimensions: 4.3 mm W x 7.3 mm L x 4 mm H
• Dissipation Factor Df: 6
• Leakage Current: 39.6 uAmps
• Product: Organic Polymer Aluminum - Chip Capacitors
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Spacing: -
• Lifetime @ Temp.: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 399-3037-2; A700X337M002AT

KEMET Aluminum Organic Capacitor (AO-CAP) – A700 Series Polymer Aluminum
Soldering Process
KEMET’s families of surface mount tantalum capacitors are
compatible with wave (single or dual), convection, IR or vapor
phase reflow techniques. Preheating of these components
is recommended to avoid extreme thermal stress. KEMET's
recommended profile conditions for convection and IR reflow reflect
the profile conditions of the IPC/J-STD-020D standard for moisture
sensitivity testing. The devices can safely withstand a maximum
of three reflow passes at these conditions. Note that although the
X/7343-43 case size can withstand wave soldering, the tall profile
(4.3mm maximum) dictates care in wave process development.
Note 1: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
* Case Size D, E, P, Y and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W and Z
Construction
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com
Time 25°C to peak temperature
Time within 5°C of max peak
Liquidous temperature (T
Time (t
Ramp-down rate (T
Time above liquidous (t
Temperature Max (T
Profile Feature
Temperature Min (T
Ramp-up rate (T
Peak Temperature (T
temperature (t
Preheat/Soak
s
) from T
smin
L
to t
to t
P
P
)
to t
Smin
Smax
smax
P
P
L
)
)
)
)
)
L
L
)
)
)
Sn-Pb Assembly
6 minutes max
3°C/sec max
6°C/sec max
20 sec max
60-120 sec
60-150 sec
235°C**
220°C*
100°C
150°C
183°C
Pb-Free Assembly
8 minutes max
3°C/sec max
6°C/sec max
30 sec max
60-120 sec
60-150 sec
260°C**
250°C*
150°C
200°C
217°C
T
T
25
smax
smin
T
T
P
L
Max Ramp Up Rate = 3 ° C/sec
Max Ramp Down Rate = 6 ° C/sec
Time/Temperature Soldering Profile
25° C to Peak
t
S
Time
T2020-1 • 4/13/2011
t
L
t
P
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