GCM1885C1H101JA16D Murata Electronics North America, GCM1885C1H101JA16D Datasheet - Page 4

• Manufacturer Part Number: GCM1885C1H101JA16D
• Description: CAP CER 100PF 50V C0G 0603
• Manufacturer: Murata Electronics North America
• Series: GCMr

Specifications of GCM1885C1H101JA16D

• Capacitance: 100pF
• Voltage - Rated: 50V
• Tolerance: ±5%
• Temperature Coefficient: C0G, NP0
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Applications: Automotive
• Ratings: AEC-Q200
• Package / Case: 0603 (1608 Metric)
• Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
• Thickness: 0.80mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Spacing: -
• Other names: 490-4767-2

!Note
No.
18
19
20 Beam Load Test
*1: The figure indicates typical specification. Please refer to individual specifications.
GCM Series Specification and Test Methods
Continued from the preceding page.
Board
Flex
Terminal
Strength
1. This Specifications and Test Methods is downloaded from the website of Murata Manufacturing co.,ltd. Therefore, it's specifications are subject to change or our products in it may be discontinued without advance notice.
0.
2. This Specifications and Test Methods has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product
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Please check with our sales representatives or product engineers before ordering.
specifications before ordering.
AEC-Q200
Test Item
Appearance
Capacitance
Change
Q/D.F.
I.R.
Appearance
Capacitance
Change
Q/D.F.
I.R.
Temperature Compensating Type
No marking defects
Within 5.0% or 0.5pF
(Whichever is larger)
30pF min.: QU1000
30pF max.: QU400+20C
C: Nominal Capacitance (pF)
More than 10,000M or 500 · F
(Whichever is smaller)
No marking defects
Within the specified tolerance
30pF min.: QU1000
30pF max.: QU400+20C
C: Nominal Capacitance (pF)
More than 10,000M or 500 · F
(Whichever is smaller)
The chip endure following force.
< Chip L dimension: 2.5mm max. >
< Chip L dimension: 3.2mm min. >
Chip thickness G 0.5mm rank: 20N
Chip thickness V 0.5mm rank: 8N
Chip thickness F 1.25mm rank: 15N
Chip thickness U 1.25mm rank: 54.5N
Specifications
*1
Within 10.0%
W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
*1
High Dielectric Type
100
Fig. 1
C
a
b
t: 1.6mm
(GCM03/15: 0.8mm)
*1
*1
Solder the capacitor on the test jig (glass epoxy board) shown in
Fig. 1 using a eutectic solder. Then apply a force in the direction
shown in Fig. 2 for 5 1sec. The soldering should be done by the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
Solder the capacitor to the test jig (glass epoxy board) shown in
Fig. 3 using a eutectic solder. Then apply *18N force in parallel
with the test jig for 60sec.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
*2N (GCM03/15)
Place the capacitor in the beam load fixture as Fig. 4.
Apply a force.
< Chip Length: 2.5mm max. >
Speed supplied the Stress Load: 0.5mm / sec.
< Chip Length: 3.2mm min. >
Speed supplied the Stress Load: 2.5mm / sec.
GCM03
GCM15
GCM18
GCM21
GCM31
GCM32
GCM03
GCM15
GCM18
GCM21
GCM31
GCM32
Type
Type
Capacitance meter
R4
45
AEC-Q200 Test Method
Fig. 3
20
0.3
0.5
0.6
0.8
2.0
2.0
0.3
0.4
1.0
1.2
2.2
2.2
Fig. 4
a
a
L
114
0.6
45
Fig. 2
Continued on the following page.
Pressunzing
speed: 1.0mm/sec
Pressurize
Iron Board
Flexure: V2
(High Dielectric Type)
Flexure: V3
(Temperature
Compensating Type)
0.9
1.5
2.2
3.0
4.4
4.4
0.9
1.5
3.0
4.0
5.0
5.0
b
b
Solder resist
Baked electrode or
copper foil
c
(t=1.6mm
GCM03/15: 0.8mm)
1.65
0.3
0.6
0.9
1.3
1.7
2.6
0.3
0.5
1.2
2.0
2.9
c
c
(in mm)
(in mm)