C0816X7S0G105M TDK Corporation, C0816X7S0G105M Datasheet - Page 13

• Manufacturer Part Number: C0816X7S0G105M
• Description: CAP CER 1.0UF 4.0V X7S 0306
• Manufacturer: TDK Corporation
• Series: Cr

Specifications of C0816X7S0G105M

• Capacitance: 1.0µF
• Voltage - Rated: 4V
• Tolerance: ±20%
• Temperature Coefficient: X7S
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Features: Low ESL
• Applications: General Purpose
• Package / Case: 0603 (1608 Metric) Wide, 0306 (0816 Metric)
• Size / Dimension: 0.032" L x 0.063" W (0.80mm x 1.60mm)
• Thickness: 0.50mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Other names: 445-4066-2; C0816X7S0G105MT

Reflow Soldering
Symbol
Excessive
solder
Adequate
solder
Insufficient
solder
• Recommended Soldering Land Pattern
• Recommended Solder Amount
• All specifications are subject to change without notice. Please read the precautions before using the product.
A
B
C
Type
Soldering
Information
B
[CC0204]
C
C0510
0.20
0.20
1.00
Chip capacitor
A
[CC0306]
C0816
0.30
0.35
1.60
Solder land
[CC0508]
C1220
Maximum amount
Minimum amount
0.50
0.55
2.00
Higher tensile
force on the chip
capacitor may
cause cracking.
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
Solder resist
[CC0612]
Unit: mm
C1632
0.725
0.75
3.20
C Series — Low ESL Flipped Type
Peak
Temp
• Recommended Soldering Profile
0
Solder
Recommended soldering duration
Recommended solder compositions
Preheating Condition
Lead-Free Solder
Manual soldering
Reflow soldering
Over 60 sec.
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Sn-Pb Solder
∆T
Soldering
Preheating
Reflow Soldering
Temp./
Peak Temp time
Dura.
Soldering Natural
US Catalog // C Series — Flipped Type // Version A11
cooling
Peak temp
230 max.
260 max.
(°C)
Reflow Soldering
Temp. (ºC)
300
∆T ≤ 150
∆T ≤ 150
0
Duration
20 max.
10 max.
∆T
(sec.)
Manual soldering
Preheating
(Solder iron)
3sec. (As short as possible)