C5750X7R2J224K TDK Corporation, C5750X7R2J224K Datasheet - Page 23

• Manufacturer Part Number: C5750X7R2J224K
• Description: CAP CER .22UF 630V X7R 10% 2220
• Manufacturer: TDK Corporation
• Series: Cr

Specifications of C5750X7R2J224K

• Capacitance: 0.22µF
• Voltage - Rated: 630V
• Tolerance: ±10%
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Features: High Voltage
• Applications: General Purpose
• Package / Case: 2220 (5750 Metric)
• Size / Dimension: 0.224" L x 0.197" W (5.70mm x 5.00mm)
• Thickness: 2.30mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Other names: 445-2305-2; C5750X7R2J224KT

• All specifications are subject to change without notice. Please read the precautions before using the product.
Material : Glass Epoxy (As per JIS C6484 GE4)
P.C. Board thickness : Appendix-2a
General
Specifications
Applied for C1005, C1608, C2012, C3216
c
Solder resist
Solder Resist
100 mm
Copper (thickness 0.035mm)
Solder resist
P.C. Board for reliability test
P.C. Board for bending test
Appendix - 1a
Appendix - 2a
Applied for C1005
Appendix-1a, 1b, 2b
b
100 mm
Copper
b
a
Copper
0.8mm
1.6mm
C Series — Mid Voltage Application
c
C1005
C1608
C2012
C3216
C3225
C4532
C5750
Applied for C1608, C2012, C3216, C3225, C4532, C5750
JIS
Case Code
US Catalog // C Series — Mid Voltage Application // Version A11
c
Solder Resist
100 mm
CC0402
CC0603
CC0805
CC1206
CC1210
CC1812
CC2220
Applied for C3225, C4532, C5750
EIA
P.C. Board for reliability test
P.C. Board for bending test
Slit
Appendix - 1b
Appendix - 2b
b
100 mm
0.4
1.0
1.2
2.2
2.2
3.5
4.5
a
Solder Resist
a
Dimensions (mm)
Copper
1.5
3.0
4.0
5.0
5.0
7.0
8.0
b
Copper
1.65
0.5
1.2
2.0
2.9
3.7
5.6
c