CKG45NX7R1H335M TDK Corporation, CKG45NX7R1H335M Datasheet - Page 13

• Manufacturer Part Number: CKG45NX7R1H335M
• Description: CAP CER 3.3UF 50V X7R 20% SMD
• Manufacturer: TDK Corporation
• Series: CKGr

Specifications of CKG45NX7R1H335M

• Capacitance: 3.3µF
• Voltage - Rated: 50V
• Tolerance: ±20%
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Features: Stacked
• Applications: Automotive
• Package / Case: Non-Standard SMD
• Size / Dimension: 0.217" L x 0.158" W (5.50mm x 4.00mm)
• Thickness: 5.50mm Max
• Dielectric Characteristic: X7R
• Capacitance Tolerance: ± 20%
• Voltage Rating: 50VDC
• Capacitor Mounting: SMD
• Operating Temperature Range: -55°C To +125°C
• External Depth: 4mm
• Rohs Compliant: Yes
• Temperature Coefficient / Code: X7R
• Product: Low ESR MLCCs
• Dimensions: 4 mm W x 5.5 mm L x 5.5 mm H
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Lead Free Status / Rohs Status: Details
• Other names: 445-2393-2

Reflow Soldering
Symbol
Excessive
solder
Adequate
solder
Insufficient
solder
• Recommended Soldering Land Pattern
• Recommended Solder Amount
• All specifications are subject to change without notice. Please read the precautions before using the product.
A
B
C
Type
Soldering
Information
C
B
CKG32K
2.0 ~ 2.2
1.1 ~ 1.3
2.3 ~ 2.5
Chip capacitor
A
CKG45K
CKG45N
3.3 ~ 3.7
1.2 ~ 1.5
2.7 ~ 3.2
Solder land
CKG57K
CKG57N
3.9 ~ 4.3
1.5 ~ 2.0
4.5 ~ 5.0
Unit: mm
Solder resist
CKG Series — Mega Cap Type Capacitors
Maximum amount
Minimum amount
Higher tensile
force on the chip
capacitor may
cause cracking.
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
Peak
Temp
• Recommended Soldering Profile
0
Solder
Recommended soldering duration
Recommended solder compositions
Preheating Condition
Lead-Free Solder
Manual soldering
Reflow soldering
Over 60 sec.
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Sn-Pb Solder
∆T
Soldering
Preheating
Method
Reflow Soldering
US Catalog // CKG Series — Mega Cap Type // Version A11
Temp./
Peak Temp time
Dura.
Soldering Natural
cooling
Peak temp
230 max.
250 max.
(°C)
Temperature (ºC)
Reflow Soldering
300
∆T ≤ 130
∆T ≤ 130
0
Duration
20 max.
10 max.
∆T
(sec.)
Manual soldering
Preheating
(Solder iron)
3sec. (As short as possible)