UMK316BJ225KD-T Taiyo Yuden, UMK316BJ225KD-T Datasheet - Page 45

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UMK316BJ225KD-T

Manufacturer Part Number
UMK316BJ225KD-T
Description
CAP CER 2.2UF 50V X5R 10% 1206
Manufacturer
Taiyo Yuden
Series
UMKr
Datasheet

Specifications of UMK316BJ225KD-T

Capacitance
2.2µF
Voltage - Rated
50V
Tolerance
±10%
Temperature Coefficient
X5R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 85°C
Applications
General Purpose
Package / Case
1206 (3216 Metric)
Size / Dimension
0.126" L x 0.063" W (3.20mm x 1.60mm)
Thickness
0.85mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Ratings
-
Lead Spacing
-
Other names
587-2402-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UMK316BJ225KD-T
Manufacturer:
TAYO YUDEN
Quantity:
360 000
【Test Methods and Remarks】
(C
【Test Methods and Remarks】
【Test Methods and Remarks】
【Test Methods and Remarks】
【Test Methods and Remarks】
* This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
mlcc_reli_e-01
8. Temperature Characteristic ( Without voltage application)
Specified
Class 1
Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation.
Class 2
Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation.
9. Deflection
Specified
10. Body Strength
Specified
High Frequency Type
Applied force: 5N
Duration: 10 sec.
11. Adhesive Strength of Terminal Electrodes
Specified
12. Solderability
Specified
C
Multilayer Ceramic Capacitors
Multilayer Ceramic Capacitors
Array Type
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Value
Value
Value
Value
Value
20
Step
Eutectic solder
Lead-free solder
85
RELIABILITY DATA
×△T           △T=65
042、063 Type
105 Type or more
-C
1
2
3
20
096、110、212 Type
(Class 1)
(Class 1)
(Class 1)
(Class 1)
(Class 1)
Temperature Compensating
High Permittivity (Class 2)
Temperature Compensating
High Permittivity (Class 2)
Temperature Compensating
High Permittivity (Class 2)
Temperature Compensating
High Permittivity (Class 2)
Temperature Compensating
High Permittivity (Class 2)
× 10
The other types
042、063 Type
(ppm/℃)
6
B、F
20℃
Maximum operating temperature
Minimum operating temperature
Sn-3.0Ag-0.5Cu
H60A or H63A
Solder type
Applied force
2N
5N
X5R、 X7R、X6S、X7S、Y5V
glass epoxy-resin substrate
glass epoxy-resin substrate
A
Standard
High Frequency Type
Standard
High Frequency Type
Standard
High Frequency Type
Standard
High Frequency Type
Standard
High Frequency Type
30±5 sec.
Duration
Solder temperature
Board
Board
25℃
230±5℃
245±3℃
A
A
Appearance :
Capacitance change : Within ±5% or ±0.5 pF, whichever is larger.
Appearance :
Capacitance change : Within±0.5 pF
Appearance :
Capacitance change : Within ±12.5% (BJ, B7, C6, C7) , Within ±30% (F)
No mechanical damage.
No terminal separation or its indication.
At least 95% of terminal electrode is covered by new solder.
Array Type
(C-C
C :Capacitance in Step 1 or Step 3
C
Temperature Characteristic [ppm/℃]
C6
C7
096 Type
110、212 Type
4±1 sec.
BJ
B7
Duration
C□ :0
R□ :ー220
S□ :ー330 SH, SJ, SK
T□ :ー470
U□ :ー750
SL :+350 to -1000
2
F
C
:Capacitance in Step 2
Thickness
Thickness
2
0.8mm
1.6mm
1.6mm
2
Specification
×100 ( %)
X5R
X7R
X6S
X7S
Y5V
B
F
CH, CJ, CK
RH
TJ, TK
UJ, UK
No abnormality
No abnormality
No abnormality
Warp
Warp
1mm
1mm
Capacitance change
Applied force
+30/ー80%
+22/ー82%
Duration
Duration
±22%
±22%
±10%
±15%
±15%
10 sec.
10 sec.
2N
5N
1 1
30±5 sec.
Board
Duration
Tolerance
H±60
J±120
K±250
Reference temperature
20℃
25℃
25℃
25℃
25℃
20℃
25℃
Warp
Capacitance measurement shall
be conducted with the board bent
Temperature Range
-55 to +125℃
-55 to +105℃
-55 to +125℃
-25 to +85℃
-55 to +85℃
-25 to +85℃
-30 to +85℃
mlcc_reli-R2

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