C0402C473J8NACTU Kemet, C0402C473J8NACTU Datasheet
C0402C473J8NACTU
Specifications of C0402C473J8NACTU
Related parts for C0402C473J8NACTU
C0402C473J8NACTU Summary of contents
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... KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com Product Bulletin W - WIDTH B - BANDWIDTH 0.5 (.02) ± .05 (.002) 0.30 (.012) ±.10 (.004) 0.8 (.032) ± .15 (.006) 0.35 (.014) ± ...
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... Soldering Process All parts incorporate the standard KEMET barrier layer of pure nickel, with an overplate of pure tin to provide excellent solderability as well as resistance to leaching. The recommended techniques are as follows: • 0402 and ≥1210 Case Sizes - Solder Refl ow Only • 0603/0805/1206 Case Sizes - Solder Wave/Solder Refl ow Marking These chips will be supplied unmarked ...
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... KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com Product Bulletin F4001 11/09 ...
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... Packaging Specifi cations © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com Product Bulletin F4001 11/09 ...