VJ2220Y823KBPAT4X Vishay, VJ2220Y823KBPAT4X Datasheet - Page 14

• Manufacturer Part Number: VJ2220Y823KBPAT4X
• Description: CAP CER .082UF 10% 250V X7R 2220
• Manufacturer: Vishay
• Series: VJr

Specifications of VJ2220Y823KBPAT4X

• Capacitance: 0.082µF
• Voltage - Rated: 250V
• Tolerance: ±10%
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Features: Soft Termination
• Applications: Boardflex Sensitive
• Package / Case: 2220 (5750 Metric)
• Size / Dimension: 0.220" L x 0.200" W (5.59mm x 5.08mm)
• Thickness: 2.18mm Max
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -

BOARDFLEX SENSITIVE APPLICATIONS - SOLUTION:
A predominant failure mode in multilayer ceramic chip capacitors is cracking caused by board flexure. Cracks can then create
a path for current to pass from one electrode through the dielectric to an opposing electrode or from the terminations at one
end of the MLCC through the dielectric to an opposing electrode. This may subsequently result in capacitance loss, leakage -
low Insulation Resistance (IR) - and/or more seriously, high current shorts. A short circuit condition in the surface mounted
capacitors can cause further failures of downstream components. Vishay’s Open Mode Design Capacitors (VJ OMD - Cap.
series) reduce the risk of these destructive conditions through MLCC designs that prevent board flexure cracks reaching the
opposing electrode.
VJ OMD - Cap. MLCCs reduce the risk of early field failures associated with board flex cracks. However, it is important to note
that even in the open mode designs the presence of flexure related cracks can cause capacitance loss leading to localized
stresses on the parts. eventually, depending on the application environment, including such factors and high voltage pulse
frequency and thermal cycling this may lead to internal breakdown of the component.
POLYMER TERMINATION
Polymer termination provides additional protection against board flexure damage by absorbing greater mechanical and thermal
stresses. Components can be packaged, transported, stored and handled the same standard terminated product. Wave and
reflow soldering of MLCC does not require modification to equipment and/or process. Polymer termination greatly reduces the
risk of mechanical cracking however it does not completely eliminate.
Document Number: 45198
Revision: 25-Jan-11
STANDARD TERMINATION
Exposed Electrodes = Electrical short
Surface Mount Multilayer Ceramic Chip Capacitor
Solutions for Boardflex Sensitive Applications
100 %
80 %
70 %
60 %
50 %
40 %
30 %
20 %
10 %
90 %
0 %
0.0
For technical questions, contact:
TYPICAL BEND TEST RESULTS 2220 CASE SIZE
1.0
Standard Termination
Polymer Termination
Log. (Standard Termination)
Log. (Polymer Termination)
2.0
BOARD FLEXURE in (mm)
3.0
4.0
5.0
OMD CAP PLUS POLYMER TERMINATION
No Exposed Electrodes = No Electrical short
[e-mail]
6.0
7.0
8.0
9.0
VJ OMD Series
Vishay Vitramon
www.vishay.com
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