C1206F224M1RACTU Kemet, C1206F224M1RACTU Datasheet - Page 3

• Manufacturer Part Number: C1206F224M1RACTU
• Description: CAP CER 0.22UF 100V X7R 1206
• Manufacturer: Kemet

Specifications of C1206F224M1RACTU

• Capacitance: 0.22µF
• Voltage - Rated: 100V
• Tolerance: ±20%
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Features: Soft Termination
• Applications: Automotive, Boardflex Sensitive
• Package / Case: 1206 (3216 Metric)
• Size / Dimension: 0.126" L x 0.063" W (3.20mm x 1.60mm)
• Thickness: 1.00mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Other names: C1206F224M1RAC; C1206F224M1RAC7800

Y
X
placement
courtyard
Grid
330mm (13.00")
178mm (7.00")
Tape & Reel Packaging
or
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, [phone]
Z
C
G
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
CERAMIC CHIP CAPACITORS
Case Sizes
Case Sizes > 1210 are 12 mm tape with 8 mm pitch
Note: TU suffix represents tape and reel packaging of marked components.
TM suffix represents tape and reel packaging of marked components.
Calculation Formula
Z = Lmin + 2Jt + Tt
G = Smax - 2Jh -Th
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined tolerances
Dimension
0402
0603
0805
1206
1210
1812
1825
2220
2225
(.315 .012")
(.472 .012")
Packaging Information
12mm .30
8mm .30
1210 are 8 mm tape with 4 mm pitch.
or
available on punched paper only.
2.14
2.78
3.30
4.50
4.50
5.90
5.90
7.00
7.00
Anti-Static Reel
Z
0402 and 0603 case sizes
Embossed Carrier*
* Punched paper carrier used for 0402 and 0603 case size.
0.28
0.68
0.70
1.50
1.50
2.30
2.30
3.30
3.30
G
Reflow Solder
KEMET offers Multilayer Ceramic Chip Capacitors
packaged in 8mm and 12mm plastic tape on 7" and
13" reels in accordance with EIA standard 481-1:
Taping of surface mount components for automatic
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 78
and page 87 for MIL-PRF-55681 chips.
for details on reeling quantities for commercial chips
0.74
1.08
1.60
2.00
2.90
3.70
6.90
5.50
6.80
X
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 81
for details on reeling quantities for commercial chips
and page 90 for MIL-PRF-55681 chips.
Y(ref)
0.93
1.05
1.30
1.50
1.50
1.80
1.80
1.85
1.85
g
C(ref)
1.21
1.73
2.00
3.00
3.00
4.10
4.10
5.15
5.15
(except 1825 Commercial, and 1825 & 2225 Military)
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
Chip Orientation
in Pocket
3.18
3.70
4.90
4.90
Z
Embossment
0.68
0.70
1.50
1.50
G
Not Recommended
Not Recommended
Wave Solder
0.80
1.10
1.40
2.00
X
Y(ref)
1.25
1.50
1.70
1.70
Smin
1.93
2.20
3.20
3.20
93