MC100EP16VB ON Semiconductor, MC100EP16VB Datasheet
MC100EP16VB
Available stocks
Related parts for MC100EP16VB
MC100EP16VB Summary of contents
Page 1
... Date Code G = Pb−Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. Publication Order Number: MC100EP16VB ...
Page 2
Figure 1. 8−Lead Pinout (Top View) and Logic Diagram Table 2. ATTRIBUTES Characteristics Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Moisture Sensitivity, Indefinite Time Out of Drypack (Note ...
Page 3
Table 3. MAXIMUM RATINGS Symbol Parameter V PECL Mode Power Supply CC V NECL Mode Power Supply EE V PECL Mode Input Voltage I NECL Mode Input Voltage I Output Current out I V Sink/Source Operating Temperature ...
Page 4
Table 5. 100EP DC CHARACTERISTICS, PECL Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note Output LOW Voltage (Note Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended ...
Page 5
Table 7. AC CHARACTERISTICS V Symbol Characteristic f Maximum Frequency (Figure 2) max t , Propagation Delay (Differential) Q PLH t (Differential) QHG, QHG PHL (Single−Ended) Q (Single−Ended) QHG, QHG t Duty Cycle Skew (Note 12) SKEW t Cycle−to−Cycle Jitter ...
Page 6
900 800 700 600 500 400 300 200 100 É É É É É É É É É É É É É É É É É É É É É É É É É É 500 1000 1500 ...
Page 7
... ORDERING INFORMATION Device MC100EP16VBD MC100EP16VBDG MC100EP16VBDR2 MC100EP16VBDR2G MC100EP16VBDT MC100EP16VBDTG MC100EP16VBDTR2 MC100EP16VBDTR2G MC100EP16VBMNR4 MC100EP16VBMNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D AN1406/D ...
Page 8
... C SEATING PLANE −Z− 0.25 (0.010 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.10 (0.004) ...
Page 9
K 8x REF 0.10 (0.004) 0.15 (0.006 L −U− PIN 1 IDENT 0.15 (0.006 −V− C 0.10 (0.004) D −T− SEATING G PLANE PACKAGE DIMENSIONS TSSOP−8 ...
Page 10
... AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. MILLIMETERS DIM MIN MAX A 0.80 1.00 A1 0.00 0.05 A3 0.20 REF b 0.20 0.30 2.00 BSC D D2 1.10 1.30 E 2.00 BSC E2 0.70 0.90 e 0.50 BSC K 0.20 −−− L 0.25 0.35 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MC100EP16VB/D ...