MC10LVEP11 ON Semiconductor, MC10LVEP11 Datasheet
MC10LVEP11
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MC10LVEP11 Summary of contents
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... MC10LVEP11, MC100LVEP11 2.5V / 3.3V ECL 1:2 Differential Fanout Buffer The MC10/100LVEP11 is a differential 1:2 fanout buffer. The device is pin and functionally equivalent to the EP11 device. With AC performance the same as the EP11 device, the LVEP11 is ideal for applications requiring lower voltage. Single−ended CLK input w 3 PECL mode ...
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Figure 1. 8−Lead Pinout (Top View) and Logic Diagram Table 2. ATTRIBUTES Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Flammability ...
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Table 3. MAXIMUM RATINGS Symbol Parameter V PECL Mode Power Supply CC V NECL Mode Power Supply EE V PECL Mode Input Voltage I NECL Mode Input Voltage I Output Current out T Operating Temperature Range A T Storage Temperature ...
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Table 4. 10LVEP DC CHARACTERISTICS, PECL Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note Output LOW Voltage (Note Input HIGH Voltage Common Mode IHCMR Range (Differential Configuration) (Note 4) I ...
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Table 6. 10LVEP DC CHARACTERISTICS, NECL Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note 10 Output LOW Voltage (Note 10 Input HIGH Voltage (Single−Ended) IH (Note 11) V Input LOW Voltage (Single−Ended) ...
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Table 8. 100LVEP DC CHARACTERISTICS, PECL Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note 17 Output LOW Voltage (Note 17 Input HIGH Voltage (Single−Ended) IH (Note 18) V Input LOW Voltage (Single−Ended) ...
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Table 10. AC CHARACTERISTICS Symbol Characteristic f Maximum Frequency (Figure 2) max t , Propagation Delay PLH t (Differential Configuration) PHL CLK Within Device Skew SKEW Device to Device Skew (Note 25) t CLOCK Random Jitter ...
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... Application Note AND8020/D − Termination of ECL Logic Devices.) ORDERING INFORMATION Device MC10LVEP11D MC10LVEP11DR2 MC10LVEP11DT MC10LVEP11DTR2 MC100LVEP11D MC100LVEP11DR2 MC100LVEP11DT MC100LVEP11DTR2 †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ...
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... C SEATING PLANE −Z− 0.25 (0.010 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.10 (0.004) ...
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... C 0.80 1.10 0.031 0.043 D 0.05 0.15 0.002 0.006 −W− F 0.40 0.70 0.016 0.028 G 0.65 BSC 0.026 BSC K 0.25 0.40 0.010 0.016 L 4.90 BSC 0.193 BSC Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. MC10LVEP11/D ...