MC74HC374ADT ON Semiconductor, MC74HC374ADT Datasheet
MC74HC374ADT
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MC74HC374ADT Summary of contents
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... Chip Complexity: 266 FETs or 66.5 Equivalent Gates • Pb−Free Packages are Available* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2010 November, 2010 − Rev. 11 http://onsemi ...
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... MC74HC374AN MC74HC374ANG MC74HC374ADW MC74HC374ADWG MC74HC374ADWR2 MC74HC374ADWR2G MC74HC374ADT MC74HC374ADTG MC74HC374ADTR2 MC74HC374ADTR2G MC74HC374AFG MC74HC374AFELG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. OUTPUT ENABLE 2 Q0 ...
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... Plastic DIP: – 10 mW/_C from 65_ to 125_C SOIC Package: – 7 mW/_C from 65_ to 125_C TSSOP Package: − 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). RECOMMENDED OPERATING CONDITIONS Symbol ...
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... I Maximum Three−State OZ Leakage Current I Maximum Quiescent Supply CC Current (per Package) NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D). AC ELECTRICAL CHARACTERISTICS Symbol f Maximum Clock Frequency (50% Duty Cycle) max t Maximum Propagation Delay, Input Clock to Q ...
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TIMING REQUIREMENTS ( pF, Input t L Symbol Parameter t Minimum Setup Time, Data to Clock su t Minimum Hold Time, Clock to Data h t Minimum Pulse Width, Clock Maximum Input Rise and ...
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TEST POINT OUTPUT DEVICE UNDER C L TEST *Includes all probe and jig capacitance Figure Clock 1 Output Enable TEST CIRCUITS OUTPUT DEVICE UNDER * ...
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SEATING PLANE 20X 0. 18X PACKAGE DIMENSIONS PDIP−20 N SUFFIX PLASTIC DIP PACKAGE CASE 738−03 ISSUE ...
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K 20X REF 0.10 (0.004) 0.15 (0.006 L PIN 1 IDENT 1 0.15 (0.006 −V− 0.100 (0.004) −T− SEATING PLANE 16X 0.36 PACKAGE DIMENSIONS TSSOP−20 DT SUFFIX ...
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... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...