MPC8260A Motorola, MPC8260A Datasheet
MPC8260A
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MPC8260A Summary of contents
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... Advance Information MPC8260AEC/D Rev. 0.7 5/2002 MPC826xA (HiP4) Family Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for HiP4-enhanced derivatives of the PowerQUICC II™ MPC8260 communications processor (collectively referred to as the MPC826xA). The following topics are addressed: Topic Section 1.1, “ ...
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... Table 2 lists each device and its related documentation. Table 2. HiP4 PowerQUICC II Documentation Document MPC8260 PowerQUICC II User’s Manual , Rev 0 (order number: MPC8260UM/D) MPC8260A (HiP4) Supplement to the MPC8260 PowerQUICC II User’s Manual (Preliminary) (order number: MPC8260AUMAD/D) PCI Bridge Functional Specification (Preliminary) (order number: MPC8265AUMAD/D) TC Layer Functional Specifi ...
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... High-performance (6.6–7.65 SPEC95 benchmark at 300 MHz; 420 Dhrystones MIPS at 300 MHz) — Supports bus snooping for data cache coherency — Floating-point unit (FPU) • Separate power supply for internal logic and for I/O MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE System Interface Unit Serial 32 Kbytes ...
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... CPU core can be disabled and the device can be used in slave mode to an external core • Communications processor module (CPM) — Embedded 32-bit communications processor (CP) uses a RISC architecture for flexible support for communications protocols 4 MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE MOTOROLA ...
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... Supports two groups of four TDM channels for a total of eight TDMs – 2,048 bytes of SI RAM – Bit or byte resolution – Independent transmit and receive routing, frame synchronization MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE 2 C) controller (identical to the MPC860 I ...
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... Features – Supports T1, CEPT, T1/E1, T3/E3, pulse code modulation highway, ISDN basic rate, ISDN primary rate, Motorola interchip digital link (IDL), general circuit interface (GCI), and user-defined TDM serial interfaces — Eight independent baud rate generators and 20 input clock pins for supplying clocks to FCCs, SCCs, SMCs, and serial channels — ...
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... This section provides AC and DC electrical specifications and thermal characteristics for the MPC826xA. 1.2.1 DC Electrical Characteristics This section describes the DC electrical characteristics for the MPC826xA. Table 3 shows the maximum electrical ratings. MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Electrical and Thermal Characteristics l ...
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... STG 1 Symbol Value 2 3 VDD 1.7 – 2.1 / 1.9 –2 VCCSYN 1.7 – 2.1 /1.9–2.1 VDDH 3.135 – 3.465 VIN GND (-0.3) – 3.465 4 T 105 0–70 A – 105 . NOTE ). CC Unit ˚C ˚C Unit ˚C ˚C MOTOROLA ...
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... XFC, UTOPIA mode, and open drain pins In UTOPIA mode -8.0mA OH PA[0-31] PB[4-31] PC[0-31] PD[4-31] In UTOPIA mode 8.0mA OL PA[0-31] PB[4-31] PC[0-31] PD[4-31] MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Electrical and Thermal Characteristics Table 5. DC Electrical Characteristics Symbol IHC V ILC I IN ...
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... DP(2)/TLBISYNC/IRQ2/EXT_DBG2 DP(3)/IRQ3/EXT_BR3/CKSTP_OUT DP(4)/IRQ4/EXT_BG3/CORE_SREST DP(5)/TBEN/IRQ5/EXT_DBG3 DP(6)/CSE(0)/IRQ6 DP(7)/CSE(1)/IRQ7 PSDVAL TA TEA GBL/IRQ1 CI/BADDR29/IRQ2 WT/BADDR30/IRQ3 L2_HIT/IRQ4 CPU_BG/BADDR31/IRQ5 CPU_DBG CPU_BR IRQ0/NMI_OUT IRQ7/INT_OUT/APE PORESET HRESET SRESET RSTCONF QREQ 10 MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Symbol Min Max V — 0.4 OL Unit V MOTOROLA ...
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... VDDH and VDD either both vary in the positive direction (+5% and +0.1 Vdc) or both vary in the negative direction (-5% and -0.1 Vdc). 2 MPC8265A and MPC8266A only. MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Electrical and Thermal Characteristics Symbol ...
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... Using this value of K the values power supply should be bypassed to ground using at least four 0.1 µF and ground should be kept to less than half an inch CC Unit Air Flow 2 °C/W NC °C/W 1 m/s °C/W NC °C/W 1 m/s (1) and T D (2) (3) and T can be obtained by solving D J and GND planes. CC MOTOROLA J ...
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... PCI 1 These are typical values at 65˚ C. The impedance may vary by ±25% with process and temperature. MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Electrical and Thermal Characteristics and GND circuits. Pull up all unused inputs or signals that will be inputs = 3W (when the ambient temperature is 70˚ ...
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... MHz 83 MHz 66 MHz 83 MHz sp16b 1 Max Delay (ns) Min Delay (ns) 66 MHz 83 MHz 66 MHz 83 MHz 0.5 1 Setup (ns) Hold (ns 2 sp17b sp36b/sp37b MOTOROLA ...
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... SCC/SMC/SPI/I2C input signals SCC/SMC/SPI/I2C output signals Figure 4. SCC/SMC/SPI/I Figure 5 shows the SCC/SMC/SPI/I SCC/SMC/SPI/I2C input signals SCC/SMC/SPI/I2C output signals Figure 5. SCC/SMC/SPI/I MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Electrical and Thermal Characteristics sp16a Figure 3. FCC Internal Clock Diagram 2 C external clock ...
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... PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE CLKin sp23 sp22 sp42/sp43 Setup (ns) Characteristic 66 MHz 83 MHz 66 MHz 83 MHz Max Delay (ns) Characteristic 66 MHz 83 MHz 66 MHz 83 MHz sp42/sp43 1 Hold (ns Min Delay (ns) 6 0.5 0.5 6.5 0.5 0.5 6.5 0.5 0.5 7 0.5 0.5 5 0.5 0.5 5.5 0.5 0.5 MOTOROLA ...
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... All other input signals PSDVAL/TEA/TA output signals ADD/ADD_atr/BADDR/CI/ GBL/WT output signals DATA bus output signals All other output signals MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Electrical and Thermal Characteristics NOTE sp20 sp21 sp40/sp41 Figure 7 ...
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... PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE CLKin sp13 sp14 DP mode input signal DP mode output signal Figure 9. Parity Mode Diagram sp34/sp30 Figure 10. MEMC Mode Diagram NOTE Tick Spacing (T1 Occurs at the Rising Edge of CLKin 1/4 CLKin 1/2 CLKin 3/10 CLKin 1/2 CLKin 4/14 CLKin 1/2 CLKin sp10 sp10 sp33b/sp30 T4 3/4 CLKin 8/10 CLKin 11/14 CLKin MOTOROLA ...
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... Table 15 describes all possible clock configurations when using the hard reset configuration sequence. Note that clock configuration changes only after POR is asserted. Note also that basic modes are shown in boldface type. MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE ...
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... MHz 5 166 MHz 6 200 MHz 7 233 MHz 8 266 MHz 4 133 MHz 5 166 MHz 6 200 MHz 7 233 MHz 8 266 MHz 4 133 MHz 5 166 MHz 6 200 MHz 7 233 MHz 8 266 MHz 4 133 MHz 5 166 MHz 6 200 MHz 7 233 MHz 8 266 MHz MOTOROLA ...
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... MHz 0110_111 66 MHz 0111_000 66 MHz 0111_001 66 MHz 0111_010 66 MHz 0111_011 66 MHz 0111_100 66 MHz 0111_101 66 MHz 0111_110 66 MHz MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE 1 (Continued) CPM Multiplication CPM 2,3 2 Factor Frequency Reserved Reserved 2 133 MHz 2 133 MHz ...
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... MHz 3.5 233 MHz 3.5 233 MHz 3.5 233 MHz 3.5 233 MHz 2 133 MHz 2.5 166 MHz 3 200 MHz NOTE Core Multiplication Core Factor Frequency 2 133 MHz 2.5 166 MHz 3 200 MHz 3.5 233 MHz 4 266 MHz 4.5 300 MHz Bypass 66 MHz Bypass 66 MHz Bypass 66 MHz MOTOROLA ...
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... MHz 3 0011_001 33 MHz 3 0011_010 33 MHz 3 0011_011 33 MHz 3 0100_000 33 MHz 3 0100_001 33 MHz 3 0100_010 33 MHz MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Core CPM Multiplication Frequency Factor 2 133 MHz 2.5 2 133 MHz 3 2.5 166 MHz 3 2.5 166 MHz 3.5 2.5 166 MHz ...
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... MHz 300 MHz 3/6 66/33 MHz 166 MHz 4/8 50/25 MHz 200 MHz 4/8 50/25 MHz 233 MHz 4/8 50/25 MHz 266 MHz 4/8 50/25 MHz 300 MHz 4/8 50/25 MHz 166 MHz 4/8 58/29 MHz 200 MHz 4/8 58/29 MHz 233 MHz 4/8 58/29 MHz 266 MHz 4/8 58/29 MHz 300 MHz 4/8 58/29 MHz 200 MHz 3/6 66/33 MHz 250 MHz 3/6 66/33 MHz MOTOROLA 2 ...
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... Input Clock CPM 2 MODCK[1–3] Frequency Multiplication 3 (PCI) Factor 000 66/33 MHz 001 66/33 MHz 010 66/33 MHz 011 66/33 MHz MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Core CPM Multiplication Frequency Factor 2 200 MHz 3 2 200 MHz 3.5 2 200 MHz 4 2 ...
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... MHz 1 Core Bus Division 60x Bus 4 5 Factor Frequency 4 33 MHz 4 33 MHz 4 33 MHz 4 33 MHz 2.5 60 MHz 2.5 60 MHz 2.5 60 MHz 2.5 60 MHz 3 44 MHz 3 44 MHz 3 44 MHz 3 44 MHz 3 44 MHz 3 66 MHz 3 66 MHz 3 66 MHz 3 66 MHz MOTOROLA 5 ...
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... MHz 4/8 1001_001 66/33 MHz 4/8 1001_010 66/33 MHz 4/8 1001_011 66/33 MHz 4/8 1001_100 66/33 MHz 4/8 1010_000 66/33 MHz 4/8 1010_001 66/33 MHz 4/8 MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Core CPM Multiplication Frequency 2 Factor 200 MHz 4.5 5 166 MHz 2.5 5 166 MHz 3 5 166 MHz 3.5 5 166 MHz ...
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... MHz 133MHz Bypass 66MHz 200MHz Bypass 80MHz 200MHz Bypass 66MHz 1 Core Bus Division 60x Bus 4 5 Factor Frequency 3 88 MHz 3 88 MHz 3 88 MHz 2.5 106 MHz 2.5 106 MHz 2.5 106 MHz 2.5 106 MHz 2.5 106 MHz 2 66 MHz 2.5 80 MHz 3 66 MHz MOTOROLA ...
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... Not to Scale Figure 12. Pinout of the 480 TBGA Package as Viewed from the Top Surface Figure 13 shows the side profile of the TBGA package to indicate the direction of the top surface view. MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE ...
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... MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE View Die Attach Die Glob-Top Filled Area Glob-Top Dam Copper Traces Table 20. Pinout List Pressure Sensitive Adhesive Etched Cavity Ball MOTOROLA ...
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... TT2 TT3 TT4 TBST TSIZ0 TSIZ1 TSIZ2 TSIZ3 AACK ARTRY DBG DBB/IRQ3 MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Table 20. Pinout List (Continued) Pinout Ball ...
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... MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Table 20. Pinout List (Continued) Ball E17 B15 B13 A11 D19 D17 D15 C13 B11 C19 C17 C15 D13 C11 E18 B17 A15 A12 D11 D18 A17 A14 B12 MOTOROLA ...
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... D63 DP0/RSRV/EXT_BR2 IRQ1/DP1/EXT_BG2 IRQ2/DP2/TLBISYNC/EXT_DBG2 IRQ3/DP3/CKSTP_OUT/EXT_BR3 IRQ4/DP4/CORE_SRESET/EXT_BG3 IRQ5/DP5/TBEN/EXT_DBG3 IRQ6/DP6/CSE0 IRQ7/DP7/CSE1 PSDVAL TA TEA GBL/IRQ1 CI/BADDR29/IRQ2 WT/BADDR30/IRQ3 L2_HIT/IRQ4 MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Table 20. Pinout List (Continued) Pinout Ball A10 C18 E16 B14 C12 B10 A7 C6 ...
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... PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Table 20. Pinout List (Continued) Ball F25 C29 E27 E28 F26 F27 F28 G25 D29 E29 F29 G28 A27 C25 E24 D24 C24 B26 A26 B25 A25 E23 B24 A24 B23 A23 D22 H28 H27 MOTOROLA ...
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... L_A30/REQ2 1 L_A31/DLLOUT 1 LCL_D0/AD0 1 LCL_D1/AD1 1 LCL_D2/AD2 1 LCL_D3/AD3 1 LCL_D4/AD4 1 LCL_D5/AD5 1 LCL_D6/AD6 1 LCL_D7/AD7 MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Table 20. Pinout List (Continued) 1 Pinout Ball H26 G29 D27 C28 E26 D25 C26 B27 D28 N27 T29 R27 R26 ...
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... PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Table 20. Pinout List (Continued) Ball L27 L26 L25 M29 M28 M27 M26 N29 T25 U27 U26 U25 V29 V28 V27 V26 W27 W26 W25 Y29 Y28 Y25 AA29 AA28 L28 N28 T28 W28 T1 D1 AH3 AG5 AJ3 AE6 AF5 MOTOROLA ...
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... PA9/SMTXD2/L1TXD0A1 PA10/FCC1_UT8_RXD0/FCC1_UT16_RXD8/MSNUM5 PA11/FCC1_UT8_RXD1/FCC1_UT16_RXD9/MSNUM4 PA12/FCC1_UT8_RXD2/FCC1_UT16_RXD10/MSNUM3 PA13/FCC1_UT8_RXD3/FCC1_UT16_RXD11/MSNUM2 PA14/FCC1_UT8_RXD4/FCC1_UT16_RXD12/FCC1_RXD3 PA15/FCC1_UT8_RXD5/FCC1_UT16_RXD13/FCC1_RXD2 PA16/FCC1_UT8_RXD6/FCC1_UT16_RXD14/FCC1_RXD1 PA17/FCC1_UT8_RXD7/FCC1_UT16_RXD15/FCC1_RXD0/FCC1_RXD PA18/FCC1_UT8_TXD7/FCC1_UT16_TXD15/FCC1_TXD0/FCC1_TXD PA19/FCC1_UT8_TXD6/FCC1_UT16_TXD14/FCC1_TXD1 PA20/FCC1_UT8_TXD5/FCC1_UT16_TXD13/FCC1_TXD2 PA21/FCC1_UT8_TXD4/FCC1_UT16_TXD12/FCC1_TXD3 PA22/FCC1_UT8_TXD3/FCC1_UT16_TXD11 PA23/FCC1_UT8_TXD2/FCC1_UT16_TXD10 MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Table 20. Pinout List (Continued) Pinout Ball AB4 AG6 AH5 AF6 AA3 AJ4 AB2 ...
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... PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Table 20. Pinout List (Continued) Ball AH9 AJ8 AH7 AF7 AD5 AF1 AD3 AB5 AD28 AD26 AD25 AE26 AH27 AG24 AH24 AJ24 AG22 AH21 AG20 AF19 AJ18 AJ17 AE14 AF13 AG12 AH11 AH16 AE15 AJ9 AE9 AJ7 AH6 AE3 AE2 MOTOROLA ...
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... PC18/CLK14/TGATE2 PC19/CLK13/BRGO7 PC20/CLK12/TGATE1 PC21/CLK11/BRGO6 PC22/CLK10/DONE1 PC23/CLK9/BRGO5/DACK1 PC24/FCC2_UT8_TXD3/CLK8/TOUT4 PC25/FCC2_UT8_TXD2/CLK7/BRGO4 PC26/CLK6/TOUT3/TMCLK PC27/FCC3_TXD/FCC3_TXD0/CLK5/BRGO3 PC28/CLK4/TIN1/TOUT2/CTS2/CLSN2 PC29/CLK3/TIN2/BRGO2/CTS1/CLSN1 PC30/FCC2_UT8_TXD3/CLK2/TOUT1 PC31/CLK1/BRGO1 MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Table 20. Pinout List (Continued) Pinout Ball AC5 AC4 AB26 AD29 AE29 AE27 AF27 AF24 AJ26 ...
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... PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Table 20. Pinout List (Continued) Ball AC28 AD27 AF29 AG25 AH26 AJ27 AJ23 AG23 AJ22 AE20 AJ20 AG18 AG17 AF16 AH15 AJ14 AH13 AJ12 AE12 AF10 AG9 AH8 AG7 AE4 AG1 AD4 AD2 AB3 B9 AB1 AE11 U5 AF25 MOTOROLA ...
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... Must be pulled down or left floating PCI devices (MPC8265A and MPC8266A) this pin should be asserted if the PCI function is desired or pulled up or left floating if PCI is not desired. On non-PCI devices (MPC8260A and MPC8264A) this is a spare pin that must be pulled up or left floating. 5 For information on how to use this pin, refer to MPC8260 PowerQUICC II Thermal Resistor Guide available at www ...
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... Package parameters are provided in Table 22. The package type is a 37.5 x 37.5 mm, 480-lead TBGA. Package Outline Interconnects Pitch Nominal unmounted package height 1. MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Table 22. Package Parameters Parameter Value 37.5 x 37.5 mm 480 ( ball array) 1.27 mm MOTOROLA ...
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... Mechanical Dimensions Figure 14 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA package. Figure 14. Mechanical Dimensions and Bottom Surface Nomenclature MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Package Description Notes: 1. Dimensions and Tolerancing per ASME Y14 ...
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... Ordering Information Figure 15 provides an example of the Motorola part numbering nomenclature for the MPC826xA. In addition to the processor frequency, the part numbering scheme also consists of a part modifier that indicates any enhancement(s) in the part from the original production design. Each part number also contains a revision code that refers to the die mask revision number and is specifi ...
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... Section 1.1, “Features”: updated performance values (under “Dual-issue integer core”) • Table 4: Notes 2 and 3 • Addition of note on page 8:VDDH and VDD tracking • Table 15: Note 3 • Table 17: Note 1 • Table 19: Note 3 MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Document Revision History Substantive Changes 45 ...
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... Document Revision History 46 MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE MOTOROLA ...
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... MOTOROLA MPC826xA (HiP4) Family Hardware Specifications PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Document Revision History 47 ...
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... Motorola and the Stylized M Logo are registered in the U.S. Patent and Trademark Office. digital dna is a trademark of Motorola, Inc. All other product or service names are the property of their respective owners. Motorola, Inc Equal Opportunity/Affirmative Action Employer. © Motorola, Inc. 2002 MPC8260AEC/D ...