W25X10 WINBOND [Winbond], W25X10 Datasheet
W25X10
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W25X10 Summary of contents
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... AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI W25X10, W25X20, W25X40, W25X80 Publication Release Date: September 22, 2006 - 1 - Preliminary - Revision I ...
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... Write Enable Latch (WEL) ............................................................................................11 10.1.3 Block Protect Bits (BP2, BP1, BP0)..............................................................................11 10.1.4 Top/Bottom Block Protect (TB) .....................................................................................11 10.1.5 Reserved Bits ...............................................................................................................11 10.1.6 Status Register Protect (SRP) ......................................................................................12 10.1.7 Status Register Memory Protection ..............................................................................13 10.2 INSTRUCTIONS........................................................................................................... 14 10.2.1 Manufacturer and Device Identification.........................................................................14 10.2.2 Instruction Set 10.2.3 Write Ensable (06h)......................................................................................................16 10.2.4 Write Disable (04h).......................................................................................................16 W25X10, W25X20, W25X40, W25X80 Table of Contents- (1) ........................................................................................................... ...
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... SOIC 150-mil (Package Code SN)...................................................................... 38 12.2 8-Pin SOIC 208-mil (Package Code SS)...................................................................... 39 12.3 8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 40 12.4 8-contact 6x5 WSON .................................................................................................... 41 12.5 8-contact 6x5 WSON Cont’d. ....................................................................................... 42 13. ORDERING INFORMATION 14. REVISION HISTORY ................................................................................................................ 44 W25X10, W25X20, W25X40, W25X80 (1) ................................................................................................. 43 Publication Release Date: September 22, 2006 - 3 - Preliminary - Revision I ...
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... GENERAL DESCRIPTION The W25X10 (1M-bit), W25X20 (2M-bit), W25X40 (4M-bit) and W25X80 (8M-bit) Serial Flash memories provide a storage solution for systems with limited space, pins and power. The 25X series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code download applications as well as storing voice, text and data. The devices operate on a single 2.7V to 3.6V power supply with current consumption as low as 5mA active and 1µ ...
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... PIN CONFIGURATION SOIC 150-MIL Figure 1a. W25X10, W25X20 and W25X40 Pin Assignments, 8-pin SOIC (Package Code SN) 4. PIN CONFIGURATION SOIC 208-MIL Figure 1b。W25X40 and W25X80 Pin Assignments, 8-pin SOIC (Package Code SS) 5. PIN CONFIGURATION PDIP 300-MIL Figure 1c。W25X10, W25X20, W25X40 and W25X80 Pin Assignments, 8-pin PDIP (Package Code DA) ...
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... PIN CONFIGURATION WSON 6X5-MM Figure 1d。W25X10, W25X20, W25X40 and W25X80 Pin Assignments, 8-pin WSON (Package Code ZP) 7. PIN DESCRIPTION SOIC 150-mil, SOIC 208-mil, PDIP 300-mil, and WSON 6x5-mm PAD NO. PAD NAME 1 / /WP 4 GND 5 DIO 6 CLK 7 /HOLD 8 VCC W25X10, W25X20, W25X40, W25X80 ...
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... At the time this datasheet was published not all package types had been finalized. Contact Winbond to confirm availability of these packages before designing to this specification. The W25X10, W25X20 and W25X40 are offered in an 8-pin plastic 150-mil width SOIC (package code SN) as shown in figure 1a ...
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... BLOCK DIAGRAM Figure 2. W25X10, W25X20, W25X40 and W25X80 Block Diagram W25X10, W25X20, W25X40, W25X80 - 8 - ...
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... Hold Function The /HOLD signal allows the W25X10/20/40/80 operation to be paused while it is actively selected (when /CS is low). The /HOLD function may be useful in cases where the SPI data and clock signals are shared with other devices. For example, consider if the page buffer was only partially written when a priority interrupt requires use of the SPI bus ...
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... Hardware write protection using Status Register and /WP pin. • Write Protection using Power-down instruction. Upon power- power-down the W25X10/20/40/80 will maintain a reset condition while VCC is below the threshold value of V reset, all operations are disabled and no instructions are recognized. During power-up and after the ...
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... Status register bit location S6 is reserved for future use. Current devices will read 0 for this bit location recommended to mask out the reserved bit when testing the Status Register. Doing this will ensure compatibility with future devices. W25X10, W25X20, W25X40, W25X80 in AC characteristics). All, none or a portion of the memory W ...
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... When the SRP pin is set the Write Status Register instruction is locked out while the /WP pin is low. When the /WP pin is high the Write Status Register instruction is allowed. W25X10, W25X20, W25X40, W25X80 Figure 3. Status Register Bit Locations - 12 - ...
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... W25X20 (2M-BIT) MEMORY PROTECTION BLOCK(S) ADDRESSES NONE NONE 3 030000h - 03FFFFh 2 and 3 020000h - 03FFFFh 0 000000h - 00FFFFh 0 and 1 000000h - 01FFFFh 0 thru 3 000000h - 03FFFFh W25X10 (1M-BIT) MEMORY PROTECTION BLOCK(S) ADDRESSES NONE NONE 1 010000h - 01FFFFh 0 000000h - 00FFFFh 0 and 1 000000h - 01FFFFh Publication Release Date: September 22, 2006 - 13 - DENSITY (KB) PORTION ...
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... INSTRUCTIONS The instruction set of the W25X10/20/80/16 consists of fifteen basic instructions that are fully controlled through the SPI bus (see Instruction Set table). Instructions are initiated with the falling edge of Chip Select (/CS). The first byte of data clocked into the DIO input provides the instruction code ...
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... DO pin. 2. The Status Register contents will repeat continuously until /CS terminates the instruction. 3. See Manufacturer and Device Identification table for Device ID information. 4. The Device ID will repeat continuously until /CS terminates the instruction. W25X10, W25X20, W25X40, W25X80 BYTE 3 BYTE 4 BYTE 5 (1) A15– ...
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... DIO pin and then driving /CS high. Note that the WEL bit is automatically reset after Power-up and upon completion of the Write Status Register, Page Program, Sector Erase, Block Erase and Chip Erase instructions. Figure 5. Write Disable Instruction Sequence Diagram W25X10, W25X20, W25X40, W25X80 - 16 - ...
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... Register cycle is in progress. This allows the BUSY status bit to be checked to determine when the cycle is complete and if the device can accept another instruction. The Status Register can be read continuously, as shown in Figure 6. The instruction is completed by driving /CS high. Figure 6. Read Status Register Instruction Sequence Diagram W25X10, W25X20, W25X40, W25X80 Publication Release Date: September 22, 2006 - 17 - Preliminary - Revision I ...
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... When the SRP pin is set the Write Status Register instruction is locked out while the /WP pin is low. When the /WP pin is high the Write Status Register instruction is allowed. Figure 7. Write Status Register Instruction Sequence Diagram W25X10, W25X20, W25X40, W25X80 - 18 - (See AC Characteristics). While W ...
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... Erase, Program or Write cycle is in process (BUSY=1) the instruction is ignored and will not have any effects on the current cycle. The Read Data instruction allows clock rates from D. maximum of f (see AC Electrical Characteristics). R Figure 8. Read Data Instruction Sequence Diagram W25X10, W25X20, W25X40, W25X80 Publication Release Date: September 22, 2006 - 19 - Preliminary - Revision I ...
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... The dummy clocks allow the devices internal circuits additional time for setting up the initial address. During the dummy clocks the data value on the DIO pin is a “don’t care”. W25X10, W25X20, W25X40, W25X80 (see AC Electrical Characteristics). This is accomplished by adding R Figure 9 ...
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... DO and DIO, instead of just DO. This allows data to be transferred from the W25X10/20/40/80 at twice the rate of standard SPI devices. The Fast Read Dual Output instruction is ideal for quickly downloading code from Flash to RAM upon power-up or for applications that cache code-segments to RAM for execution ...
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... After the Page Program cycle has finished the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Page Program instruction will not be executed if the addressed page is protected by the Block Protect (BP2, BP1, and BP0) bits (see Status Register Memory Protection table). Figure 11. Page Program Instruction Sequence Diagram W25X10, W25X20, W25X40, W25X80 - 22 - ...
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... Erase instruction will not be executed if the addressed page is protected by the Block Protect (TB, BP2, BP1, and BP0) bits (see Status Register Memory Protection table). Figure 12. Sector Erase Instruction Sequence Diagram W25X10, W25X20, W25X40, W25X80 (See AC Characteristics). While the Sector SE Publication Release Date: September 22, 2006 ...
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... Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Block Erase instruction will not be executed if the addressed page is protected by the Block Protect (TB, BP2, BP1, and BP0) bits (see Status Register Memory Protection table). Figure 13. Block Erase Instruction Sequence Diagram W25X10, W25X20, W25X40, W25X80 (See AC Characteristics). While the Block ...
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... Latch (WEL) bit in the Status Register is cleared to 0. The Chip Erase instruction will not be executed if any page is protected by the Block Protect (BP2, BP1, and BP0) bits (see Status Register Memory Protection table). Figure 14. Chip Erase Instruction Sequence Diagram W25X10, W25X20, W25X40, W25X80 (See AC Characteristics). While the Chip Erase cycle Publication Release Date: September 22, 2006 ...
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... Ignoring all but one instruction makes the Power Down state a useful condition for securing maximum write protection. The device always powers-up in the normal operation with the standby current of ICC1. Figure 15. Deep Power-down Instruction Sequence Diagram W25X10, W25X20, W25X40, W25X80 (See AC Characteristics). While in the power-down state only the - 26 - ...
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... Device ID bits are then shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in figure 17. The Device ID values for the W25X10, W25X20, W25X40 AND W25X80 are listed in Manufacturer and Device Identification table. The Device ID can be read continuously. The instruction is completed by driving /CS high ...
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... W25X10, W25X20, W25X40, W25X80 Figure 17. Release Power-down / Device ID Instruction Sequence Diagram - 28 - ...
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... Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in figure 18. The Device ID values for the W25X10, W25X20, W25X40 AND W25X80 are listed in Manufacturer and Device Identification table. If the 24-bit address is initially set to 000001h the Device ID will be read first and then followed by the Manufacturer ID ...
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... JEDEC ID (9Fh) For compatibility reasons, the W25X10/20/40/80 provides several instructions to electronically determine the identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI compatible serial memories that was adopted in 2003. The instruction is initiated by driving the /CS pin low and shifting the instruction code “9Fh”. The ...
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... VCC voltage during Read can operate across the min and max range but should not exceed ±10% of the programming (erase/write) voltage. 2. Commercial temperature only applies to Fast Read (F Industrial temperature applies to all other parameters. W25X10, W25X20, W25X40, W25X80 RELIMINARY (1) SYMBOL CONDITIONS VCC ...
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... Data Retention Full Temperature Range 11.4 Power-up Timing and Write Inhibit Threshold PARAMETER VCC (min) to /CS Low Time Delay Before Write Instruction Write Inhibit Threshold Voltage Note: 1. These parameters are characterized only. W25X10, W25X20, W25X40, W25X80 CONDITIONS SYMBOL t (1) VSL t (1) PUW ...
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... Input High Voltage V IH Output Low Voltage V OL Output High Voltage V OH Notes: 1. Tested on sample basis and specified through design and characterization data. TA=25° C, VCC 3V. 2. Checker Board Pattern. W25X10, W25X20, W25X40, W25X80 CONDITIONS MIN ( (2) OUT /CS = VCC, VIN = GND or VCC ...
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... Load Capacitance Load Capacitance for FR only 1 Input Rise and Fall Times Input Pulse Voltages Input Timing Reference Voltages Output Timing Reference Voltages Note: 1. Output Hi-Z is defined as the point where data out is no longer driven. W25X10, W25X20, W25X40, W25X80 SYMBOL ...
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... Data In Setup Time Data In Hold Time /CS Active Hold Time relative to CLK /CS Not Active Setup Time relative to CLK /CS Deselect Time Output Disable Time Clock Low to Output Valid W25X10/20/40: 2.7V-3.6V / 3.0V-3.6V W25X80: 2.7V-3.6V / 3.0V-3.6V Output Hold Time W25X10, W25X20, W25X40, W25X80 SYMBOL ALT ...
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... Byte Program Time (First Byte) Additional Byte Program Time (After First Byte) Page Program Time Sector Erase Time (4KB) Block Erase Time (64KB) Chip Erase Time W25X10 / W25X20 Chip Erase Time W25X40 Chip Erase Time W25X80 Notes: 1. Clock high + Clock low must be less than or equal to 1/f 2 ...
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... Serial Output Timing 11.10 Input Timing 11.11 Hold Timing W25X10, W25X20, W25X40, W25X80 Publication Release Date: September 22, 2006 - 37 - Preliminary - Revision I ...
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... BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package. 4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane. W25X10, W25X20, W25X40, W25X80 MILLIMETERS TYP. ...
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... BSC = Basic lead spacing between centers. 3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package. 4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane. W25X10, W25X20, W25X40, W25X80 MILLIMETERS INCHES ...
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... Symbol α W25X10, W25X20, W25X40, W25X80 Base Plane 1 Seating Plane 1 Dimension in inch Dimension in mm Nom Nom Min Max Min 0.175 0.010 0.25 0.125 0.130 0.135 3.18 3.30 0.016 0.018 0.41 0.46 0.022 ...
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... WSON W25X10, W25X20, W25X40, W25X80 Publication Release Date: September 22, 2006 - 41 - Preliminary - Revision I ...
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... WSON Cont’d. W25X10, W25X20, W25X40, W25X80 - 42 - ...
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... Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and Reel (shape T), when placing orders. 1c. The “W” prefix is not included on the part marking. 2. Please check with Winbond for availability Only the 2 letter is used for the part marking. W25X10, W25X20, W25X40, W25X80 (1) Publication Release Date: September 22, 2006 - 43 - Preliminary - Revision I ...
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... D 09/26/05 E 02/13/06 F 05/11/06 G 06/06/06 H 06/22/06 I 09/22/06 W25X10, W25X20, W25X40, W25X80 PAGE New Create Updated datasheet to comply with Winbond ALL Standard Updated hex values in Manufacturer and Device Identification Table. Updated F fr values in Operating Ranges Table and AC Characteristics Table 14, 35 Added availability of 208-mil SOIC package for W25X40 ...
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... FAX: 886-2-8751-3579 Please note that all data and specifications are subject to change without notice. All the trademarks of products and companies mentioned in this datasheet belong to their respective owners. W25X10, W25X20, W25X40, W25X80 Winbond Electronics Corporation America 2727 North First Street, San Jose, CA 95134, U ...