X28HC256 Xicor, X28HC256 Datasheet
X28HC256
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X28HC256 Summary of contents
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... The X28HC256 also supports the JEDEC standard Software Data Pro- tection feature for protecting against inadvertent writes during power-up and power-down. Endurance for the X28HC256 is specified as a minimum Cell 100,000 write cycles per byte and an inherent data retention of 100 years. ...
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... The Output Enable input controls the data output buffers and is used to initiate read operations. Data In/Data Out (I/O –I Data is written to or read from the X28HC256 through the I/O pins. Write Enable (WE) The Write Enable input controls the writing of data to the X28HC256. FUNCTIONAL DIAGRAM A 0 –A 14 ...
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... HIGH. Write Write operations are initiated when both CE and WE are LOW and OE is HIGH. The X28HC256 supports both a CE and WE controlled write cycle. That is, the address is latched by the falling edge of either CE or WE, whichever occurs last. Similarly, the data is latched internally by the rising edge of either CE whichever occurs first ...
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... READY HIGH DATA Polling can effectively halve the time for writing to the X28HC256. The timing diagram in Figure 2 illus- trates the sequence of events on the bus. The software flow diagram in Figure 3 illustrates one method of implementing the routine. NO 3859 FHD F13 4 ...
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... DATA Polling. This can be especially helpful in an array comprised of multiple X28HC256 memories that is frequently up- dated. The timing diagram in Figure 4 illustrates the sequence of events on the bus. The software flow diagram in Figure 5 illustrates a method for polling the Toggle Bit ...
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... SOFTWARE DATA PROTECTION The X28HC256 offers a software controlled data protec- tion feature. The X28HC256 is shipped from Xicor with the software data protection NOT ENABLED; that is, the device will be in the standard operating mode. In this mode data should be protected during power-up/down operations through the use of external circuits ...
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... X28HC256 will automatically disable further writes un- less another command is issued to cancel it further commands are issued the X28HC256 will be write protected during power-down and after any subsequent power-up. Note: Once initiated, the sequence of write operations should not be interrupted ...
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... E 2 PROM programmer, the following six step algo- rithm will reset the internal protection circuit. After t the X28HC256 will be in standard operating mode. Note: Once initiated, the sequence of write operations should not be interrupted. 3859 FHD F19 8 ...
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... Because the X28HC256 has two power modes, standby and active, proper decoupling of the memory array is of prime concern. Enabling CE will cause transient current spikes ...
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... X28HC256 ABSOLUTE MAXIMUM RATINGS* Temperature under Bias X28HC256 .................................. – +85 C X28HC256I, X28HC256M ......... – +135 C Storage Temperature ....................... – +150 C Voltage on any Pin with Respect to V .................................. –1V to +7V SS D.C. Output Current ........................................... 10mA Lead Temperature (Soldering, 10 seconds) ...... 300 C RECOMMENDED OPERATING CONDITIONS Temperature Min ...
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... X28HC256 POWER-UP TIMING Symbol PUR (3) t PUW (3) t CAPACITANCE 1MHz Symbol I/O (9) C Input/Output Capacitance IN (9) C Input Capacitance ENDURANCE AND DATA RETENTION Parameter Endurance Data Retention A.C. CONDITIONS OF TEST Input Pulse Levels Input Rise and Fall Times 5ns Input and Output Timing Levels 1 ...
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... LZ HZ OLZ from the point whin CE, OE return HIGH (whichever occurs first) to the time when the outputs are no longer driven. (5) For faster 256K products, refer to X28VC256 product line. X28HC256-70 X28HC256-90 X28HC256-12 X28HC256-15 Min. Max. Min ...
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... X28HC256 Write Cycle Limits Symbol WC (7) t Write Cycle Time t Address Setup Time AS t Address Hold Time AH t Write Setup Time CS t Write Hold Time CH CE Pulse Width HIGH Setup Time t OES OE HIGH Hold Time t OEH WE Pulse Width HIGH Recovery (page write only) ...
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... X28HC256 CE Controlled Write Cycle ADDRESS OES DATA IN DATA OUT Page Write Cycle ( (10) ADDRESS I/O BYTE 0 *For each successive write within the page write operation –A 14 should be the same or writes to an unknown address could occur. ...
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... X28HC256 DATA Polling Timing Diagram (11 ADDRESS I/O 7 Toggle Bit Timing Diagram (11 OEH OE HIGH Z I/O 6 *I/O beginning and ending state will vary, depending upon actual t 6 Note: (11) Polling operations are by definition read cycles and are therefore subject to read cycle timings. ...
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... X28HC256 PACKAGING INFORMATION 28-LEAD PLASTIC DUAL IN-LINE PACKAGE TYPE P PIN 1 INDEX PIN 1 SEATING PLANE 0.150 (3.81) 0.125 (3.17) 0.110 (2.79) 0.090 (2.29) TYP. 0.010 (0.25) NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 1.460 (37.08) 1.400 (35.56) 0.550 (13.97) 0.510 (12.95) 1.300 (33.02) REF. 0.062 (1.57) 0.020 (0.51) 0.050 (1.27) 0.016 (0.41) 0.610 (15.49) 0.590 (14.99 0.085 (2.16) 0.040 (1.02) ...
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... X28HC256 PACKAGING INFORMATION 28-LEAD HERMETIC DUAL IN-LINE PACKAGE TYPE D PIN 1 SEATING PLANE 0.200 (5.08) 0.125 (3.18) 0.110 (2.79) 0.090 (2.29) TYP. 0.100 (2.54) TYP. 0.010 (0.25) NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 1.490 (37.85) 1.435 (36.45) 1.30 (33.02) REF. 0.070 (1.78) 0.030 (0.76) TYP. 0.055 (1.40) TYP. 0.018 (0.46) 0.620 (15.75) 0.590 (14.99) TYP. 0.614 (15.60 0.610 (15.49) ...
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... X28HC256 PACKAGING INFORMATION 32-LEAD PLASTIC LEADED CHIP CARRIER PACKAGE TYPE J 0.420 (10.67) 0.045 (1.14 0.495 (12.57) 0.485 (12.32) TYP. 0.490 (12.45) 0.453 (11.51) 0.447 (11.35) TYP. 0.450 (11.43) 0.300 (7.62) REF. PIN 1 NOTES: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. DIMENSIONS WITH NO TOLERANCE FOR REFERENCE ONLY 0.050 (1.27) TYP. 0.021 (0.53) 0.013 (0.33) SEATING PLANE TYP ...
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... X28HC256 PACKAGING INFORMATION 28-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S 0.1040 (2.6416) 0.0940 (2.3876) 0 – 8 NOTES: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. FORMED LEAD SHALL BE PLANAR WITH RESPECT TO ONE ANOTHER WITHIN 0.004 INCHES 3. BACK EJECTOR PIN MARKED “KOREA” 4. CONTROLLING DIMENSION: INCHES (MM) ...
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... X28HC256 PACKAGING INFORMATION 32-PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE TYPE E 0.150 (3.81) BSC 0.015 (0.38) 0.003 (0.08) PIN 1 0.200 (5.08) BSC 0.028 (0.71) 0.022 (0.56) (32) PLCS. 0.458 (11.63) 0.442 (11.22) 0.458 (11.63) 0.300 (7.62) 32 NOTE: 1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2. TOLERANCE: 1% NTL 0.005 (0.127) 0.020 (0.51 REF. 0.095 (2.41) 0.075 (1.91) 0.022 (0.56) 0.006 (0.15) ...
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... X28HC256 PACKAGING INFORMATION 28-LEAD CERAMIC PIN GRID ARRAY PACKAGE TYPE TYP. 0.100 ALL LEADS PIN 1 INDEX 0.660 (16.76) 0.640 (16.26) NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS NOTE: LEADS 4,12,18 & ...
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... X28HC256 PACKAGING INFORMATION 0.740 (18.80) MAX. 0.006 (0.15) 0.003 (0.08) 0.370 (9.40) 0.250 (6.35) TYP. 0.300 2 PLCS. NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 28-LEAD CERAMIC FLAT PACK PIN 1 INDEX 1 28 0.440 (11.18) MAX. 0.180 (4.57) MIN. 0.030 (0.76) MIN. 22 0.019 (0.48) 0.015 (0.38) 0.050 (1.27) BSC 0.045 (1.14) MAX. 0.130 (3.30) 0.090 (2.29) 0.045 (1.14) 0.025 (0.66) ...
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... X28HC256 PACKAGING INFORMATION SEE NOTE 2 8.02 (0.315) 7.98 (0.314) 1.18 (0.046) 1.02 (0.040) 0.58 (0.023) 0.42 (0.017) SOLDER PADS FOOTPRINT NOTE: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES IN PARENTHESES). 32-LEAD THIN SMALL OUTLINE PACKAGE (TSOP) TYPE T SEE NOTE 2 12.50 (0.492) 12.30 (0.484) PIN #1 IDENT. O 0.76 (0.03) 14.15 (0.557) 13.83 (0.544) 14.80 ± 0.05 (0.583 ± 0.002) 0.30 ± ...
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... X28HC256 ORDERING INFORMATION X28HC256 Device LIMITED WARRANTY Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty, express, statutory, implied description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. ...