ESD5Z6.0T1G ON Semiconductor, ESD5Z6.0T1G Datasheet - Page 4

• Manufacturer Part Number: ESD5Z6.0T1G
• Description: TVS ESD ASD 181W 6.0V SOD-523
• Manufacturer: ON Semiconductor

Specifications of ESD5Z6.0T1G

• Voltage - Reverse Standoff (typ): 6V
• Voltage - Breakdown: 6.8V
• Power (watts): 181W
• Polarization: Unidirectional
• Mounting Type: Surface Mount
• Package / Case: SOD-523
• Number Of Elements: 1
• Polarity: Uni-Directional
• Package Type: SOD-523
• Operating Temperature Classification: Military
• Reverse Breakdown Voltage: 6.8V
• Clamping Voltage: 20.5V
• Reverse Stand-off Voltage: 6V
• Leakage Current (max): 10nA
• Peak Pulse Current: 8.8A
• Peak Pulse Power Dissipation: 240W
• Test Current (it): 1mA
• Operating Temp Range: -55C to 150C
• Mounting: Surface Mount
• Pin Count: 2
• Channels: 1 Channel
• Operating Voltage: 6 V
• Breakdown Voltage: 6.8 V
• Termination Style: SMD/SMT
• Peak Surge Current: 8.8 A
• Capacitance: 70 pF
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 55 C
• Dimensions: 0.8 mm W x 1.2 mm L
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ESD5Z6.0T1G; ESD5Z6.0T1GOSTR

PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: [phone] or 800-344-3860 Toll Free USA/Canada
Fax: [phone] or 800-344-3867 Toll Free USA/Canada
Email: [e-mail]
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
D
2 PL
0.08 (0.003)
J
1
M
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
T
X Y
A
S
K
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
-X-
2
C
B
SEATING
PLANE
-T-
-Y-
0.0547
N. American Technical Support: 800-282-9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: [phone]
Japan Customer Focus Center
Phone: [phone]
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
1.40
ESD5Z2.5T1 SERIES
http://onsemi.com
CASE 502-01
0.0157
SOD-523
ISSUE C
0.40
4
NOTES:
SCALE 10:1
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
1982.
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
DIM
A
B
C
D
J
K
S
0.0157
0.40
MIN
1.10
0.70
0.50
0.25
0.07
0.15
1.50
inches
mm
MILLIMETERS
NOM
1.20
0.80
0.60
0.30
0.14
0.20
1.60
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
1.30
0.90
0.70
0.35
0.20
0.25
1.70
0.0028
0.043
0.028
0.020
0.010
0.006
0.059
MIN
0.0055
INCHES
0.047
0.032
0.024
0.012
0.008
0.063
NOM
ESD5Z2.5T1/D
0.0079
0.051
0.035
0.028
0.014
0.010
0.067
MAX