PIC16F636-I/SL Microchip Technology, PIC16F636-I/SL Datasheet - Page 190
![IC PIC MCU FLASH 2KX14 14-SOIC](/photos/6/59/65933/150-14-soic_sml.jpg)
PIC16F636-I/SL
Manufacturer Part Number
PIC16F636-I/SL
Description
IC PIC MCU FLASH 2KX14 14-SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC12F635-ISN.pdf
(234 pages)
3.PIC16F636-ISL.pdf
(8 pages)
4.PIC16F636-ISL.pdf
(4 pages)
5.PIC16F636-IST.pdf
(196 pages)
Specifications of PIC16F636-I/SL
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
14-SOIC (3.9mm Width), 14-SOL
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, LVD, POR, WDT
Number Of I /o
11
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
RS- 232, SPI, USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit
Data Rom Size
256 B
Height
1.25 mm
Length
8.65 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
3.9 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162057 - MPLAB ICD 2 HEADER 14DIP
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F636-I/SL
Manufacturer:
MICROCHIP
Quantity:
3 400
Part Number:
PIC16F636-I/SL
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC12F635/PIC16F636/639
15.11 AC Characteristics: Analog Front-End for PIC16F639 (Industrial) (Continued)
DS41232D-page 188
AC CHARACTERISTICS
Param
AF14
AF15
AF16
AF17
AF18
AF19
AF20
AF21
AF22
AF23
AF24
AF25
AF26
AF27
AF28
AF29
Note 1:
No.
*
†
2:
T
T
LFDATA
T
LFDATA
T
T
T
T
Sym.
T
F
T
T
ALARM
T
T
Parameter is characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested.
Required output enable filter high time must account for input path analog delays (= T
Required output enable filter low time must account for input path analog delays (= T
INACT
PAGC
R
STAB
PRES
C
AGC
RDY
OSC
OEH
OEL
GAP
T
LC
IN
E
R Rise time of LFDATA
F Fall time of LFDATA
AGC initialization time
High time after AGC settling time
AGC stabilization time plus high
time (after AGC settling time)
(T
Gap time after AGC settling time
Time from exiting Sleep or POR to
being ready to receive signal
Minimum time AGC level must be
held after receiving AGC Preserve
command
Internal RC oscillator frequency
(±10%)
Inactivity timer time-out
Alarm timer time-out
LC Pin Input Impedance
LCX, LCY, LCZ
LC Pin Input Capacitance
LCX, LCY, LCZ
Time element of pulse
Minimum output enable filter high
time
OEH (Bits Config0<7:6>)
Minimum output enable filter low
time
OEL (Bits Config0<5:4>)
AGC
01 = 1 ms
10 = 2 ms
11 = 4 ms
00 = Filter Disabled
00 = 1 ms
01 = 1 ms
10 = 2 ms
11 = 4 ms
+ T
PAGC
Characteristic
)
Standard Operating Conditions (unless otherwise stated)
Supply Voltage
Operating temperature
LC Signal Input
Carrier Frequency
LCCOM connected to V
128 (~4ms)
128 (~4ms)
32 (~1ms)
64 (~2ms)
32 (~1ms)
32 (~1ms)
64 (~2ms)
28.8
14.4
28.8
Min
200
100
—
—
—
—
—
5*
—
—
—
4
Typ†
62.5
3.5*
0.5
0.5
—
—
—
—
32
16
32
1*
24
—
—
—
—
—
—
—
—
—
SS
Max
35.2
17.6
35.2
50*
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2.0V
-40°C
Sinusoidal 300 mV
125 kHz
MOhm Device in Standby mode
Units
count
count
clock
clock
kHz
OEL
ms
ms
ms
ms
ms
ms
pF
OEH
s
s
s
s
s
V
T
DD
+ T
AMB
- T
V
Time is measured from 10% to 90% of
amplitude
V
Time is measured from 10% to 90% of
amplitude
Time required for AGC stabilization
Equivalent to two Internal clock cycle (F
AGC stabilization time
Typically 1 T
AGC level must not change more than 10%
during T
Internal clock trimmed at 32 kHz during test
512 cycles of RC oscillator @ F
1024 cycles of RC oscillator @ F
LCCOM grounded. Vdd = 3.0V,
F
RC oscillator = F
Viewed from the pin input:
(Note 1)
RC oscillator = F
Viewed from the pin input:
(Note 2)
DR
DR
DD
DD
CARRIER
3.6V
- T
+ T
+85°C for industrial
DF
3.0V
3.0V
PP
DF
© 2007 Microchip Technology Inc.
PRES
).
).
= 125 kHz
E
.
OSC
OSC
Conditions
OSC
OSC
OSC
)