PIC16F684-I/ST Microchip Technology, PIC16F684-I/ST Datasheet - Page 176
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PIC16F684-I/ST
Manufacturer Part Number
PIC16F684-I/ST
Description
IC PIC MCU FLASH 2KX14 14TSSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F684-ISL.pdf
(4 pages)
4.PIC16F684-ISL.pdf
(192 pages)
5.PIC16F684-ISL.pdf
(6 pages)
6.PIC16F684-IST.pdf
(164 pages)
Specifications of PIC16F684-I/ST
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
14-TSSOP
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
12
Eeprom Size
256 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT14SS-1 - SOCKET TRANSITION 14DIP/14SSOP
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F684-I/ST
Manufacturer:
KEMET
Quantity:
1 000
Part Number:
PIC16F684-I/ST
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Company:
Part Number:
PIC16F684-I/STG
Manufacturer:
LYONTEK
Quantity:
100
Part Number:
PIC16F684-I/STG
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC16F684
17.2
The following sections give the technical details of the packages.
DS41202F-page 174
14-Lead Plastic Dual In-Line (P or PD) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
NOTE 1
Package Details
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
A
A1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
N
1
2
b
b1
3
D
Dimension Limits
e
Units
A2
A1
E1
eB
b1
N
A
D
e
E
L
c
b
A2
E1
.015
.290
.240
.735
.008
.045
.014
MIN
.115
.115
–
–
L
.100 BSC
INCHES
NOM
.130
.310
.250
.750
.130
.010
.060
.018
14
–
–
–
Microchip Technology Drawing C04-005B
© 2007 Microchip Technology Inc.
MAX
.210
.195
.325
.280
.775
.150
.015
.070
.022
.430
eB
–
E
c