PIC16C620A-20/P Microchip Technology, PIC16C620A-20/P Datasheet - Page 101

IC MCU OTP 512X14 COMP 18DIP

PIC16C620A-20/P

Manufacturer Part Number
PIC16C620A-20/P
Description
IC MCU OTP 512X14 COMP 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets

Specifications of PIC16C620A-20/P

Core Size
8-Bit
Program Memory Size
896B (512 x 14)
Oscillator Type
External
Core Processor
PIC
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
13
Program Memory Type
OTP
Ram Size
96 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Operating Temperature
0°C ~ 70°C
Package / Case
18-DIP (0.300", 7.62mm)
Controller Family/series
PIC16C
No. Of I/o's
13
Ram Memory Size
128Byte
Cpu Speed
20MHz
No. Of Timers
1
Digital Ic
RoHS Compliant
Processor Series
PIC16C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
96 B
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
13
Number Of Timers
8
Operating Supply Voltage
3 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
0 C
Data Rom Size
96 B
Height
3.3 mm
Length
22.86 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
3 V
Width
6.35 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
ISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMING309-1059 - ADAPTER 18 ZIF BD W/18SO PLUGSDVA16XP180 - ADAPTER DEVICE FOR MPLAB-ICEAC164010 - MODULE SKT PROMATEII DIP/SOIC
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
 Details
12.5
 2003 Microchip Technology Inc.
DC CHARACTERISTICS
D001
D002
D003
D004
D005
D010
D020
D022
D022A
D023
D023A
1A
Note 1:
Param
No.
2:
3:
4:
5:
6:
7:
† Data in "Typ" column is at 5.0V, 25°C, unless otherwise stated. These parameters are for design guidance only and are
* These parameters are characterized but not tested.
V
V
V
S
V
I
I
∆I
∆I
∆I
∆I
∆I
∆I
∆I
∆I
F
DD
PD
DC CHARACTERISTICS:
not tested.
This is the limit to which V
The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate,
The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP
For RC
The ∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the base I
Commercial temperature range only.
See Section 12.1 and Section 12.3 for 16C62X and 16CR62X devices for operation between 20 MHz and 40 MHz for valid modified
OSC
oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption.
The test conditions for all I
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
mode, with all I/O pins in hi-impedance state and tied to V
2R
measurement.
characteristics.
DD
DR
POR
VDD
BOR
WDT
BOR
COMP
VREF
EE
EE
EE
EE
Sym
EXT
Write
Read
OSC
(mA) with R
configuration, current through R
Supply Voltage
RAM Data Retention Voltage
V
Power-on Reset
V
Reset
Brown-out Detect Voltage
Supply Current
Power Down Current
WDT Current
Brown-out Reset Current
Comparator Current for each
Comparator
V
Operating Current
Operating Current
Standby Current
Standby Current
LP Oscillator Operating Frequency
RC Oscillator Operating Frequency
XT Oscillator Operating Frequency
HS Oscillator Operating Frequency
DD
DD
REF
start voltage to ensure
rise rate to ensure Power-on
Current
EXT
in kΩ.
Characteristic
DD
(5)
DD
(5)
(5)
can be lowered in SLEEP mode without losing RAM data.
(2,4)
measurements in Active Operation mode are:
(3)
PIC16C620A/C621A/C622A-40
PIC16CR620A-40
(5)
EXT
(1)
is not included. The current through the resistor can be estimated by the formula Ir = V
0.05
3.65
Min Typ† Max Units
3.0
Standard Operating Conditions (unless otherwise stated)
Operating temperature
0
0
0
0
*
DD
or V
1.5*
V
4.0
1.2
0.4
1.0
4.0
4.0
6.0
35
75
30
80
SS
SS
.
(7)
4.35
125
135
100
200
5.5
2.0
1.2
2.0
6.0
7.0
2.2
5.0
9.0
70
15
10
12
60
30
20
(Commercial)
3
1
4
4
V/ms See section on Power-on Reset for details
MHz
MHz
MHz
kHz
mA
mA
mA
mA
mA
mA
mA
DD
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
V
V
V
V
, MCLR = V
F
Device in SLEEP mode
See section on Power-on Reset for details
BOREN configuration bit is cleared
F
XT O
F
XT O
F
HS O
F
HS O
F
HS O
F
LP O
V
V
V
V
V
(125°C)
BOD enabled, V
V
V
V
V
V
All temperatures
All temperatures
All temperatures
All temperatures
OSC
OSC
OSC
OSC
OSC
OSC
OSC
DD
DD
DD
DD
DD
DD
DD
CC
CC
CC
0°C ≤ TA ≤ +70°C for commercial
(7)
= 3.0V
= 4.5V*
= 5.5V
= 5.5V Extended
= 4.0V
= 4.0V
= 4.0V
= 5.5V, SCL = 400 kHz
= 3.0V, EE V
= 3.0V, EE V
SC
SC
SC
SC
SC
SC
= DC to 20 MHz
= 4 MHz, V
= 4 MHz, V
= 10 MHz, V
= 20 MHz, V
= 20 MHz, V
= 32 kHz, V
DD
(Commercial)
mode
mode, (Note 4)*
mode, (Note 4)
; WDT enabled/disabled as specified.
mode, (Note 6)
mode
mode
PIC16C62X
DD
Conditions
DD
DD
DD
DD
DD
DD
DD
DD
= 5.0V
= 5.5V, WDT disabled,
= 3.0V, WDT disabled,
= V
= V
= 3.0V, WDT disabled,
= 5.5V, WDT disabled*,
= 3.0V, WDT disabled,
= 4.5V, WDT disabled,
CC
CC
DS30235J-page 99
DD
or I
PD
DD
/

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