PIC18LF13K50-I/P Microchip Technology, PIC18LF13K50-I/P Datasheet - Page 23
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PIC18LF13K50-I/P
Manufacturer Part Number
PIC18LF13K50-I/P
Description
IC PIC MCU FLASH 4KX16 20-PDIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18F13K50-ISS.pdf
(420 pages)
2.PIC18F13K50-ISS.pdf
(40 pages)
3.PIC18F13K50-ISS.pdf
(10 pages)
4.PIC18F13K50-ISS.pdf
(2 pages)
5.PIC18F13K50-ISO.pdf
(414 pages)
Specifications of PIC18LF13K50-I/P
Core Size
8-Bit
Program Memory Size
8KB (4K x 16)
Core Processor
PIC
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
14
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-DIP (0.300", 7.62mm)
Controller Family/series
PIC18
No. Of I/o's
15
Eeprom Memory Size
256Byte
Ram Memory Size
512Byte
Cpu Speed
48MHz
No. Of Timers
4
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
EUSART, I2C, MSSP, SPI, USB
Maximum Clock Frequency
32 KHz
Number Of Programmable I/os
18
Number Of Timers
4
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM164127, DV164126
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 12 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
5.0
5.1
Program Flash is accessed one byte at a time via the
4-bit command, ‘1001’ (table read, post-increment).
The contents of memory pointed to by the Table
Pointer (TBLPTRU:TBLPTRH:TBLPTRL) are serially
output on PGD.
TABLE 5-1:
FIGURE 5-1:
2010 Microchip Technology Inc.
Step 1: Set Table Pointer
0000
0000
0000
0000
0000
0000
Step 2: Read memory and then shift out on PGD, LSb to MSb
1001
PGC
Command
PGD
Note 1:
4-bit
READING THE DEVICE
Read Program Flash, ID Locations
and Configuration Bits
Magnification of the high-impedance delay between PGC and PGD is shown in Figure 5-5.
1
1
READ PROGRAM FLASH SEQUENCE
2
0
0E <Addr[21:16]>
0E <Addr[15:8]>
0E <Addr[7:0]>
Data Payload
3
TABLE READ POST-INCREMENT INSTRUCTION TIMING DIAGRAM (1001)
0
4
6E F8
6E F7
6E F6
00 00
1
P5
PGD = Input
1
2
3
PIC18F1XK50/PIC18LF1XK50
MOVLW Addr[21:16]
MOVWF TBLPTRU
MOVLW <Addr[15:8]>
MOVWF TBLPTRH
MOVLW <Addr[7:0]>
MOVWF TBLPTRL
TBLRD *+
4
Advance Information
5
6
7
8
P6
The 4-bit command is shifted in LSb first. The read is
executed during the next 8 clocks, then shifted out on
PGD during the last 8 clocks, LSb to MSb. A delay of
P6 must be introduced after the falling edge of the 8th
PGC of the operand to allow PGD to transition from an
input to an output. During this time, PGC must be held
low, as illustrated in Figure 5-1. This operation also
increments the Table Pointer by one, pointing to the
next byte in program Flash for the next read.
This technique will work to read any memory in the
000000h to 3FFFFFh address space, so it also applies
to the reading of the ID and Configuration registers.
9
LSb
P14
10
1
Core Instruction
11
2
PGD = Output
12
Shift Data Out
3
13
4
14
5
15
6
16
MSb
P5A
(Note 1)
Fetch Next 4-bit Command
1
PGD = Input
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DS41342E-page 23
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