PIC18LF13K50-I/P Microchip Technology, PIC18LF13K50-I/P Datasheet - Page 373
![IC PIC MCU FLASH 4KX16 20-PDIP](/photos/12/13/121303/150-20-dip_sml.jpg)
PIC18LF13K50-I/P
Manufacturer Part Number
PIC18LF13K50-I/P
Description
IC PIC MCU FLASH 4KX16 20-PDIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18F13K50-ISS.pdf
(420 pages)
2.PIC18F13K50-ISS.pdf
(40 pages)
3.PIC18F13K50-ISS.pdf
(10 pages)
4.PIC18F13K50-ISS.pdf
(2 pages)
5.PIC18F13K50-ISO.pdf
(414 pages)
Specifications of PIC18LF13K50-I/P
Core Size
8-Bit
Program Memory Size
8KB (4K x 16)
Core Processor
PIC
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
14
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-DIP (0.300", 7.62mm)
Controller Family/series
PIC18
No. Of I/o's
15
Eeprom Memory Size
256Byte
Ram Memory Size
512Byte
Cpu Speed
48MHz
No. Of Timers
4
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
EUSART, I2C, MSSP, SPI, USB
Maximum Clock Frequency
32 KHz
Number Of Programmable I/os
18
Number Of Timers
4
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM164127, DV164126
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 12 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
- PIC18F13K50-ISS PDF datasheet
- PIC18F13K50-ISS PDF datasheet #2
- PIC18F13K50-ISS PDF datasheet #3
- PIC18F13K50-ISS PDF datasheet #4
- PIC18F13K50-ISO PDF datasheet #5
- Current page: 373 of 414
- Download datasheet (4Mb)
27.6
© 2009 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Legend:
Note 1:
Param
No.
2:
3:
Thermal Considerations
P
INTERNAL
T
P
TBD = To Be Determined
I
T
T
Sym
P
DD
JMAX
θ
θ
PD
A
J
DER
JC
I
JA
/
= Ambient Temperature
= Junction Temperature
O
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
A
Characteristic
≤ +125°C
PIC18F1XK50/PIC18LF1XK50
Preliminary
108.1
TBD
62.4
85.2
31.4
Typ
150
24
24
24
—
—
—
—
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C
W
W
W
W
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 5x5mm package
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 6x6mm package
PD = P
P
P
P
INTERNAL
I
DER
/
O
= Σ (I
= PD
INTERNAL
OL
= I
MAX
* V
DD
Conditions
(T
OL
+ P
x V
J
) + Σ (I
- T
DD
I
/
O
A
DS41350C-page 371
(1)
)/θ
OH
JA
(2)
* (V
DD
- V
OH
))
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