PIC16F1937-I/P Microchip Technology, PIC16F1937-I/P Datasheet - Page 364

IC PIC MCU FLASH 512KX14 40-PDIP

PIC16F1937-I/P

Manufacturer Part Number
PIC16F1937-I/P
Description
IC PIC MCU FLASH 512KX14 40-PDIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr

Specifications of PIC16F1937-I/P

Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
32MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
36
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 14x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
EUSART/MI2C/SPI
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
36
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
14-ch x 10-bit
A/d Bit Size
10 bit
A/d Channels Available
14
Height
4.95 mm
Length
53.21 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.8 V
Width
14.73 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

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Part Number
Manufacturer
Quantity
Price
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Manufacturer:
CYPRESS
Quantity:
460
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Manufacturer:
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Part Number:
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Part Number:
PIC16F1937-I/PT
0
PIC16F193X/LF193X
28.2
DS41364A-page 362
PIC16LF193X
PIC16F193X
D019
Legend:
Note 1:
Param
No.
*
2:
3:
4:
5:
DC Characteristics: PIC16F193X/LF193X-I/E (Industrial, Extended) (Continued)
These parameters are characterized but not tested.
TBD = To Be Determined
The test conditions for all I
rail-to-rail; all I/O pins tri-stated, pulled to V
The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current
consumption.
For RC oscillator configurations, current through R
by the formula I
FVR and BOR are disabled.
0.1 μF capacitor on V
Characteristics
Device
R
= V
DD
CAP
/2R
Min.
(RA0).
DD
EXT
measurements in active operation mode are: OSC1 = external square wave, from
(mA) with R
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Typ†
5.3
6.0
DD
EXT
Max.
Preliminary
TBD
TBD
; MCLR = V
in kΩ.
EXT
Units
is not included. The current through the resistor can be extended
mA
mA
DD
; WDT disabled.
-40°C ≤ T
-40°C ≤ T
-40°C ≤ T
-40°C ≤ T
V
3.0
5.0
DD
A
A
A
A
≤ +85°C for industrial
≤ +125°C for extended
≤ +85°C for industrial
≤ +125°C for extended
F
HS Oscillator mode (Note 5)
OSC
= 32 MHz
Conditions
© 2008 Microchip Technology Inc.
Note

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