PIC16F913-I/SO Microchip Technology, PIC16F913-I/SO Datasheet - Page 265

• Manufacturer Part Number: PIC16F913-I/SO
• Description: IC PIC MCU FLASH 4KX14 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F913-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 7KB (4K x 14)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
• Number Of I /o: 24
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: SSP/I2C/AUSART/SPI
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 24
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

19.6
© 2007 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
Param
No.
2:
3:
Thermal Considerations
θ
θ
T
PD
P
P
P
I
T
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (P
DD
JA
JC
A
J
INTERNAL
I
DER
Symbol
/
O
= Ambient Temperature.
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C ≤ T
Characteristic
A
≤ +125°C
DER
).
PIC16F913/914/916/917/946
Typ.
60.0
80.0
90.0
27.5
47.2
46.0
24.4
77.0
31.4
24.0
24.0
20.0
24.7
14.5
20.0
24.4
150
—
—
—
—
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C
W
W
W
W
28-pin PDIP package
28-pin SOIC package
28-pin SSOP package
28-pin QFN 6x6 mm package
40-pin PDIP package
44-pin TQFP package
44-pin QFN 8x8 mm package
64-pin TQFP package
28-pin PDIP package
28-pin SOIC package
28-pin SSOP package
28-pin QFN 6x6 mm package
40-pin PDIP package
44-pin TQFP package
44-pin QFN 8x8 mm package
64-pin TQFP package
For derated power calculations
PD = P
P
(NOTE 1)
P
P
(NOTE 2, 3)
INTERNAL
I
DER
/
O
= Σ (I
= (T
INTERNAL
OL
J
= I
- T
* V
DD
A
Conditions
OL
)/θ
+ P
x V
) + Σ (I
JA
I
DD
/
O
DS41250F-page 263
OH
* (V
DD
- V
OH
))