PIC16F648A-I/SS Microchip Technology, PIC16F648A-I/SS Datasheet - Page 165
![IC MCU FLASH 4KX14 EEPROM 20SSOP](/photos/6/58/65895/150-20-ssop_sml.jpg)
PIC16F648A-I/SS
Manufacturer Part Number
PIC16F648A-I/SS
Description
IC MCU FLASH 4KX14 EEPROM 20SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F627A-IP.pdf
(180 pages)
3.PIC16F627A-IP.pdf
(8 pages)
4.PIC16F627A-IP.pdf
(22 pages)
5.PIC16F648A-ISS.pdf
(178 pages)
Specifications of PIC16F648A-I/SS
Core Size
8-Bit
Program Memory Size
7KB (4K x 14)
Core Processor
PIC
Speed
20MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-SSOP
Controller Family/series
PIC16F
No. Of I/o's
16
Eeprom Memory Size
256Byte
Ram Memory Size
256Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
SCI, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
16
Number Of Timers
1 x 16 bit
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT20SS-1 - SOCKET TRANSITION 18DIP 20SSOPI3DBF648 - BOARD DAUGHTER ICEPIC3AC164307 - MODULE SKT FOR PM3 28SSOPAC164018 - MODULE SKT PROMATEII 20SSOP
Data Converters
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F648A-I/SS
Manufacturer:
AD
Quantity:
240
Part Number:
PIC16F648A-I/SS
Manufacturer:
PIC18F14K50-I/SS
Quantity:
20 000
© 2007 Microchip Technology Inc.
18-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
N
1
2 3
b
D
Dimension Limits
α
E1
A2
E
PIC16F627A/628A/648A
Units
A2
A1
E1
L1
N
A
E
D
α
e
h
L
φ
c
b
β
φ
MIN
2.05
0.10
0.25
0.40
0.20
0.31
L
0°
5°
5°
–
h
L1
MILLIMETERS
10.30 BSC
11.55 BSC
1.27 BSC
7.50 BSC
1.40 REF
NOM
18
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-051B
h
β
MAX
2.65
0.30
0.75
1.27
0.51
0.33
15°
15°
8°
–
DS40044F-page 163
c