PIC18F4221-I/P Microchip Technology, PIC18F4221-I/P Datasheet
PIC18F4221-I/P
Specifications of PIC18F4221-I/P
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PIC18F4221-I/P Summary of contents
Page 1
... Pins 12, 13, 33 and 34 to “NC”, No Connect. Additionally, the diagram’s second note – concern- ing “Special ICPORT features” – has been removed, such that the diagram appears as shown below RC0/T1OSO/T13CKI OSC2/CLKO/RA6 3 OSC1/CLKI/RA7 30 4 PIC18F4221 PIC18F4321 RE2/CS/AN7 27 7 RE1/WR/AN6 26 8 RE0/RD/AN5 9 ...
Page 2
... Alternate assignment for CCP2 when Configuration bit, CCP2MX, is cleared. DS80310G-page 2 3. Module: PIC18F4221/4321 Pinout I/O Descriptions Table Table 1-3: PIC18F4221/4321 Pinout I/O Descriptions, beginning on Page 16, has been changed to remove four rows. With Data Sheet Clarifications 2 and 3, the table now appears as shown. ...
Page 3
... TABLE 1-3: PIC18F4221/4321 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Number Pin Name PDIP QFN TQFP RA0/AN0 2 19 RA0 AN0 RA1/AN1 3 20 RA1 AN1 RA2/AN2/V -/ REF REF RA2 AN2 V - REF CV REF RA3/AN3 REF RA3 AN3 V + REF RA4/T0CKI/C1OUT 6 23 RA4 T0CKI C1OUT RA5/AN4/SS/HLVDIN C2OUT ...
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... PIC18F2221/2321/4221/4321 TABLE 1-3: PIC18F4221/4321 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Number Pin Name PDIP QFN TQFP RB0/INT0/FLT0/AN12 33 9 RB0 INT0 FLT0 AN12 RB1/INT1/AN10 34 10 RB1 INT1 AN10 RB2/INT2/AN8 35 11 RB2 INT2 AN8 RB3/AN9/CCP2 36 12 RB3 AN9 (2) CCP2 RB4/KBI0/AN11 37 14 RB4 KBI0 AN11 ...
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... TABLE 1-3: PIC18F4221/4321 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Number Pin Name PDIP QFN TQFP RC0/T1OSO/T13CKI 15 34 RC0 T1OSO T13CKI RC1/T1OSI/CCP2 16 35 RC1 T1OSI (1) CCP2 RC2/CCP1/P1A 17 36 RC2 CCP1 P1A RC3/SCK/SCL 18 37 RC3 SCK SCL RC4/SDI/SDA 23 42 RC4 SDI SDA RC5/SDO 24 43 ...
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... PIC18F2221/2321/4221/4321 TABLE 1-3: PIC18F4221/4321 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Number Pin Name PDIP QFN TQFP RD0/PSP0 19 38 RD0 PSP0 RD1/PSP1 20 39 RD1 PSP1 RD2/PSP2 21 40 RD2 PSP2 RD3/PSP3 22 41 RD3 PSP3 RD4/PSP4 27 2 RD4 PSP4 RD5/PSP5/P1B 28 3 RD5 PSP5 P1B RD6/PSP6/P1C ...
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... TABLE 1-3: PIC18F4221/4321 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Number Pin Name PDIP QFN TQFP RE0/RD/AN5 8 25 RE0 RD AN5 RE1/WR/AN6 9 26 RE1 WR AN6 RE2/CS/AN7 10 27 RE2 CS AN7 RE3 — — — 13 Legend: TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels ...
Page 8
... Bit 0 Unprogrammed Value FOSC1 FOSC0 00-- 0111 ---1 1111 WDTEN ---1 1111 1--- -011 — STVREN 1000 -1-1 CP1 CP0 ---- --11 — — 11-- ---- WRT1 WRT0 ---- --11 — — 111- ---- EBTR1 EBTR0 ---- --11 — — -1-- ---- (2) REV1 REV0 xxxx xxxx DEV4 DEV3 0000 1100 © 2008 Microchip Technology Inc. ...
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... XINST: Extended Instruction Set Enable bit 1 = Instruction set extension and Indexed Addressing mode enabled 0 = Instruction set extension and Indexed Addressing mode disabled (Legacy mode) bit 5-4 BBSIZ1:BBSIZ0: Boot Block Size Select bits PIC18F4221/4321 Devices 1024 Words 01 = 512 Words 00 = 256 Words PIC18F2221/2321 Devices: ...
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... ICPORTS • ICV PP • ICRST • Special ICPORT Features . PART NO. X /XX Device Temperature Package Range (1) Device PIC18F2221/2321 , PIC18F4221/4321 (2) PIC18F2221/2321T , PIC18F4221/4321T V range 4.2V to 5.5V DD (1) PIC18LF2221/2321 , PIC18LF4221/4321 (2) PIC18LF2221/2321T , PIC18LF4221/4321T V range 2.0V to 5.5V DD Temperature Range I = -40°C to +85°C (Industrial -40°C to +125°C (Extended) ...
Page 11
... Idle state for transmit (TX high level Synchronous mode Idle state for clock (CK high level 0 = Idle state for clock (CK low level © 2008 Microchip Technology Inc. PIC18F2221/2321/4221/4321 In this document’s Revision E change, the Synchronous mode content was removed from the bit 5 (RXDTP) description. ...
Page 12
... N e 0.65 BSC A 0.80 A1 0.00 A3 0.20 REF E 6.00 BSC E2 3.65 D 6.00 BSC D2 3.65 b 0.23 L 0. NOM MAX 28 0.90 1.00 0.02 0.05 3.70 4.20 3.70 4.20 0.30 0.35 0.55 0.70 – – Microchip Technology Drawing C04-105B © 2008 Microchip Technology Inc. ...
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... Note 1: This is the limit to which With BOR enabled, full-speed operation (F V may be below the minimum voltage for this frequency. DD © 2008 Microchip Technology Inc. PIC18F2221/2321/4221/4321 Supply Voltage PIC18F2221/2321/4221/4321 (Industrial) PIC18LF2221/2321/4221/4321 (Industrial) Standard Operating Conditions (unless otherwise stated) -40°C ≤ T Operating temperature Standard Operating Conditions (unless otherwise stated) -40° ...
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... Conditions V = 2.0V DD (Sleep mode 3.0V DD (Sleep mode 5.0V DD (Sleep mode and all features that © 2008 Microchip Technology Inc. ...
Page 15
... BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. 5: When operation below -10°C is expected, use T1OSC high-power mode where LPT1OSC (CONFIG3H<2>) = © 2008 Microchip Technology Inc. PIC18F2221/2321/4221/4321 Power-Down and Supply Current PIC18F2221/2321/4221/4321 (Industrial) ...
Page 16
... Conditions MHz OSC V = 3.0V DD (RC_RUN mode, INTOSC source 5. 2. kHz OSC V = 3.0V DD (RC_IDLE mode, INTRC source 5. and all features that © 2008 Microchip Technology Inc. . ...
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... BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. 5: When operation below -10°C is expected, use T1OSC high-power mode where LPT1OSC (CONFIG3H<2>) = © 2008 Microchip Technology Inc. PIC18F2221/2321/4221/4321 Power-Down and Supply Current PIC18F2221/2321/4221/4321 (Industrial) ...
Page 18
... Conditions MHz OSC V = 3.0V DD (PRI_RUN, EC oscillator 5. 2. MHz OSC V = 3.0V DD (PRI_RUN, EC oscillator 5. 4. MHz DD OSC (PRI_RUN 5. oscillator 4. MHz OSC (PRI_RUN, EC oscillator 5. and all features that © 2008 Microchip Technology Inc. . ...
Page 19
... BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. 5: When operation below -10°C is expected, use T1OSC high-power mode where LPT1OSC (CONFIG3H<2>) = © 2008 Microchip Technology Inc. PIC18F2221/2321/4221/4321 Power-Down and Supply Current PIC18F2221/2321/4221/4321 (Industrial) ...
Page 20
... Conditions MHz OSC V = 3.0V DD (PRI_IDLE mode, EC oscillator 5. 2. MHz OSC V = 3.0V DD (PRI_IDLE mode, EC oscillator 5. 4. MHz DD OSC (PRI_IDLE mode 5. oscillator 4. MHz OSC (PRI_IDLE mode, EC oscillator 5. and all features that © 2008 Microchip Technology Inc. . ...
Page 21
... BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. 5: When operation below -10°C is expected, use T1OSC high-power mode where LPT1OSC (CONFIG3H<2>) = © 2008 Microchip Technology Inc. PIC18F2221/2321/4221/4321 Power-Down and Supply Current PIC18F2221/2321/4221/4321 (Industrial) ...
Page 22
... Conditions 3.0V DD SLEEP Mode BOREN1:BOREN0 = and all features that © 2008 Microchip Technology Inc. . ...
Page 23
... BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. 5: When operation below -10°C is expected, use T1OSC high-power mode where LPT1OSC (CONFIG3H<2>) = © 2008 Microchip Technology Inc. PIC18F2221/2321/4221/4321 Power-Down and Supply Current PIC18F2221/2321/4221/4321 (Industrial) ...
Page 24
... LVV = 1010 3.52 3.71 3.90 LVV = 1011 3.70 3.90 4.10 LVV = 1100 3.90 4.11 4.32 LVV = 1101 4.11 4.33 4.55 LVV = 1110 4.36 4.59 4.82 LVV = 1111 1.10 1.20 1.30 Units Conditions HLVDIN input/internal reference voltage © 2008 Microchip Technology Inc. ...
Page 25
... Higher leakage current may be measured at different input voltages. 3: Negative current is defined as current sourced by the pin. © 2008 Microchip Technology Inc. PIC18F2221/2321/4221/4321 The new values change the first page of Section 26.3 “DC Characteristics” as shown. (New values are indicated by bold text.) Standard Operating Conditions (unless otherwise stated) Operating temperature -40° ...
Page 26
... LSb ΔV ≥ 3.0V REF LSb ΔV ≥ 3.0V REF LSb ΔV ≥ 3.0V REF ≤ ≤ — AIN REF < 3. ≥ 3. kΩ μA During V acquisition. AIN μA During A/D conversion cycle. source. REFH source. REFL © 2008 Microchip Technology Inc. ...
Page 27
... Characteristics, I/O Port Leakage Current). Rev G Document (5/2008) Modified Data Sheet Clarifications 11 (Electrical Characteristics) and 12 (Electrical Characteristics, I/O Port Leakage Current). Added Data Sheet Clarifica- tions 13 (Peripheral Highlights) and 14 (A/D Converter Characteristics). © 2008 Microchip Technology Inc. PIC18F2221/2321/4221/4321 10 (Packaging 11 (Electrical 12 (Electrical DS80310G-page 27 ...
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... PIC18F2221/2321/4221/4321 NOTES: DS80310G-page 28 © 2008 Microchip Technology Inc. ...
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... PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...
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... Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 © 2008 Microchip Technology Inc. EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 ...