PIC18F4450-I/PT Microchip Technology, PIC18F4450-I/PT Datasheet - Page 301
PIC18F4450-I/PT
Manufacturer Part Number
PIC18F4450-I/PT
Description
IC PIC MCU FLASH 8KX16 44TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC18F2221-ISO.pdf
(46 pages)
2.PIC18F2450-ISO.pdf
(324 pages)
3.PIC18F2450-ISO.pdf
(6 pages)
4.PIC18F2450-ISO.pdf
(8 pages)
5.PIC18F2450-ISO.pdf
(4 pages)
6.PIC18F2450-ISO.pdf
(4 pages)
7.PIC18F4450-IP.pdf
(322 pages)
Specifications of PIC18F4450-I/PT
Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
44-TQFP, 44-VQFP
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
UART/USART, USB
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
34
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 13x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
EUSART/USB
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
34
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM163025, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
13-ch x 10-bit
Height
1 mm
Length
10 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
10 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163025 - PIC DEM FULL SPEED USB DEMO BRD444-1001 - DEMO BOARD FOR PICMICRO MCUAC164020 - MODULE SKT PROMATEII 44TQFP
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F4450-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC18F2221-ISO PDF datasheet
- PIC18F2450-ISO PDF datasheet #2
- PIC18F2450-ISO PDF datasheet #3
- PIC18F2450-ISO PDF datasheet #4
- PIC18F2450-ISO PDF datasheet #5
- PIC18F2450-ISO PDF datasheet #6
- PIC18F4450-IP PDF datasheet #7
- Current page: 301 of 322
- Download datasheet (6Mb)
23.2
The following sections give the technical details of the packages.
© 2007 Microchip Technology Inc.
28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Package Details
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1
2
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
3
b
b1
D
Dimension Limits
Preliminary
Units
A2
A1
E1
b1
eB
N
A
E
D
e
L
c
b
e
1.345
.120
.015
.290
.240
.110
.008
.040
.014
A2
MIN
E1
–
–
PIC18F2450/4450
L
.100 BSC
INCHES
1.365
NOM
.135
.310
.285
.130
.010
.050
.018
28
–
–
–
Microchip Technology Drawing C04-070B
eB
E
1.400
MAX
.200
.150
.335
.295
.150
.015
.070
.022
.430
–
DS39760C-page 299
c
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