PIC16C63A-04/SO Microchip Technology, PIC16C63A-04/SO Datasheet - Page 3

• Manufacturer Part Number: PIC16C63A-04/SO
• Description: IC MCU OTP 4KX14 PWM 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C63A-04/SO

• Program Memory Type: OTP
• Program Memory Size: 7KB (4K x 14)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Ram Size: 192 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Processor Series: PIC16C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 192 B
• Interface Type: I2C/SPI/USART
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 3
• Operating Supply Voltage: 4.5 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: 0 C
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 4 MHz
• Data Rom Size: 192 B
• Height: 2.31 mm
• Length: 17.87 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 3.65 V
• Width: 7.49 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

2. Module: Packaging (Pinout and Product
FIGURE 1:
FIGURE 2:
 2003 Microchip Technology Inc.
PIC16C63A and PIC16C73B devices are now
offered in 28-pin near chip-scale micro lead frame
packages (commonly known as “QFN”). This
packaging type has been added to the product line
since the latest revision of the Device Data Sheet.
The addition of this option requires the following
additions to the Device Data Sheet. The
referenced figures and tables follow this text.
1. The “Pin Diagram” on page 2 of the Data Sheet
is amended with the addition of the 28-pin QFN
pinout, shown in Figure 1.
QFN (28-pin)
Identification)
PINOUT DIAGRAM FOR PIC16C63A AND PIC16C73B, 28-PIN QFN
PACKAGE MARKING TEMPLATE FOR PIC16C63A AND PIC16C73B, 28-PIN QFN
RA3/AN3/V
28-Lead QFN
YYWWNNN
XXXXXXXX
XXXXXXXX
RA5/AN4/SS
OSC2/CLKO
OSC1/CLKI
RA4/T0CKI
RA2/AN2
REF
V
SS
+
1
2
3
4
5
6
7
28
8 9
PIC16C63A
PIC16C73B
27
PIC16C63A/65B/73B/74B
26
10 11
25
12 13 14
24
23
22
2. Table 3-1 of Section 3.0 (“Architectural
3. Section 18.1 (“Package Marking Information”)
4. Section 18.0
5. Table B-1 (“Device Differences”) is amended to
21
20
19
18
17
16
15
Overview”) is replaced with an updated version
that adds a column for QFN pin assignments.
All new information is indicated in bold.
is amended to include a marking template and
example for 28-pin QFN devices. These are
shown in Figure 2.
amended to include the mechanical drawings
of the 28-pin QFN package. These are shown
in Figure 3 and Figure 4, respectively.
include the 28-pin QFN for the PIC16C63A and
PIC16C73B devices.
RB3
RB2
RB1
RB0/INT
V
V
RC7/RX/DT
Example
DD
SS
-I/ML
0310017
PIC16C63A
(“Package
Information”)
DS80164A-page 3
is