PIC24HJ32GP302-I/SO Microchip Technology, PIC24HJ32GP302-I/SO Datasheet - Page 336
![IC PIC MCU FLASH 32K 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
PIC24HJ32GP302-I/SO
Manufacturer Part Number
PIC24HJ32GP302-I/SO
Description
IC PIC MCU FLASH 32K 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.PIC24HJ32GP302-ISO.pdf
(368 pages)
3.PIC24HJ32GP302-ISO.pdf
(8 pages)
4.PIC24HJ32GP302-ISO.pdf
(12 pages)
5.PIC24HJ32GP304-EML.pdf
(356 pages)
Specifications of PIC24HJ32GP302-I/SO
Core Size
16-Bit
Program Memory Size
32KB (11K x 24)
Core Processor
PIC
Speed
40 MIPs
Connectivity
I²C, PMP, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
21
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Controller Family/series
PIC24
No. Of I/o's
21
Ram Memory Size
4KB
Cpu Speed
40MIPS
No. Of Timers
7
No. Of Pwm Channels
4
Embedded Interface Type
I2C, SPI, UART
Rohs Compliant
Yes
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
4 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM300027
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel / 12 bit, 10 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164339 - MODULE SKT FOR PM3 28SOIC
Eeprom Size
-
Lead Free Status / Rohs Status
Details
- PIC24HJ12GP201-ISO PDF datasheet
- PIC24HJ32GP302-ISO PDF datasheet #2
- PIC24HJ32GP302-ISO PDF datasheet #3
- PIC24HJ32GP302-ISO PDF datasheet #4
- PIC24HJ32GP304-EML PDF datasheet #5
- Current page: 336 of 368
- Download datasheet (5Mb)
PIC24HJ32GP302/304, PIC24HJ64GPX02/X04 AND PIC24HJ128GPX02/X04
TABLE 29-12: SPIx MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
TABLE 29-13: SPIx MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS
DS70293E-page 336
HSP35
HSP40
HSP41
HSP51
HSP60
Note 1:
CHARACTERISTICS
HSP35
HSP40
HSP41
HSP51
Note 1:
CHARACTERISTICS
Param
Param
No.
No.
2:
2:
AC
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssH2doZ
AC
These parameters are characterized but not tested in manufacturing.
Assumes 50 pF load on all SPIx pins.
These parameters are characterized but not tested in manufacturing.
Assumes 50 pF load on all SPIx pins.
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssH2doZ SSx ↑ to SDO
TssL2doV
Symbol
Symbol
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input to
SCKx Edge
SSx ↑ to SDOx Output
High-Impedance
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
High-Impedance
SDOx Data Output Valid after
SSx Edge
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
Characteristic
Characteristic
X
Output
(1)
(1)
-40°C ≤ T
-40°C ≤ T
A
A
Min
Min
—
25
25
15
25
25
15
≤ +150°C for High Temperature
—
—
≤ +150°C for High Temperature
Typ
Typ
—
—
—
—
—
—
—
—
—
Max
Max
35
—
—
55
35
55
55
—
—
Units
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
© 2011 Microchip Technology Inc.
See Note 2
See Note 2
Conditions
Conditions
—
—
—
—
—
—
—
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