DSPIC33FJ32GP302-I/SO Microchip Technology, DSPIC33FJ32GP302-I/SO Datasheet - Page 377
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DSPIC33FJ32GP302-I/SO
Manufacturer Part Number
DSPIC33FJ32GP302-I/SO
Description
IC DSPIC MCU/DSP 32K 28SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ32GP204-IPT.pdf
(14 pages)
2.DSPIC33FJ32GP302-ISO.pdf
(412 pages)
3.DSPIC33FJ64GP804-IML.pdf
(402 pages)
4.DSPIC33FJ32GP204-IPT.pdf
(270 pages)
Specifications of DSPIC33FJ32GP302-I/SO
Program Memory Type
FLASH
Program Memory Size
32KB (32K x 8)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
21
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Data Ram Size
4 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Minimum Operating Temperature
- 40 C
Package
28SOIC W
Device Core
dsPIC
Family Name
dsPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Interface Type
I2C/SPI/UART
On-chip Adc
10-chx10-bit|10-chx12-bit
Number Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- DSPIC33FJ32GP204-IPT PDF datasheet
- DSPIC33FJ32GP302-ISO PDF datasheet #2
- DSPIC33FJ64GP804-IML PDF datasheet #3
- DSPIC33FJ32GP204-IPT PDF datasheet #4
- Current page: 377 of 412
- Download datasheet (6Mb)
TABLE 31-5:
TABLE 31-6:
TABLE 31-7:
© 2011 Microchip Technology Inc.
DC CHARACTERISTICS
HDC72a
HDC72f
HDC72g
Note 1:
DC CHARACTERISTICS
HDO10
HDO16
HDO20
HDO26
DC CHARACTERISTICS
HD130 E
HD134 T
Note 1:
Parameter
Param
Param
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04
No.
No.
No.
2:
Symbol
V
V
RETD
Parameters with Doze ratios of 1:2 and 1:64 are characterized, but are not tested in manufacturing.
P
These parameters are assured by design, but are not characterized or tested in manufacturing.
Programming of the Flash memory is not allowed above 125°C.
Symbol
OL
OH
Typical
DC CHARACTERISTICS: DOZE CURRENT (I
DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
DC CHARACTERISTICS: PROGRAM MEMORY
Program Flash Memory
Cell Endurance
Characteristic Retention
39
18
18
Output Low Voltage
I/O ports
OSC2/CLKO
Output High Voltage
I/O ports
OSC2/CLKO
(1)
Characteristic
Characteristic
Max
45
25
25
(1)
10,000
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Min
20
2.40
2.41
Min
Ratio
1:128
Doze
1:64
—
—
1:2
Typ
—
—
Typ
Units
—
—
—
—
mA
mA
mA
Max
—
—
Max
DOZE
0.4
0.4
—
—
+150°C
-40°C ≤ T
-40°C ≤ T
-40°C ≤ T
Units
)
Year
E/W
Units
V
V
V
V
A
A
-40° C to +150ºC
1000 E/W cycles or less and no
other specifications are violated
A
≤ +150ºC for High Temperature
≤ +150°C for High Temperature
≤ +150ºC for High Temperature
I
I
I
I
OL
OL
OH
OH
3.3V
Conditions
= 1 mA, V
= 1 mA, V
= -1 mA, V
= -1 mA, V
Conditions
Conditions
DS70292E-page 377
DD
DD
(2)
DD
DD
20 MIPS
= 3.3V
= 3.3V
= 3.3V
= 3.3V
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